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Laser microdissection system with visualizing means, display device for laser microdissection system and method for laser microdissection

机译：具有可视化装置的激光显微切割系统，用于激光显微切割系统的显示装置和用于激光显微切割的方法

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摘要

It is a laser microdissection system (100), which is a microscope (10) with a reflected light means (76) for focusing a laser beam (b) by means of a microscope objective (41) of the microscope (10) to a to dissektierendes object (51) and means for separating a dissektats (511) from the to object (51) by means of the focused laser beam (b), wherein the laser microdissection system (100) further comprises means for receiving a dissection collecting container (55) for collecting the dissektats (511) and means for visualizing the dissektats (511) in the dissection collecting container (55), is proposed. The means for visualizing the dissektats (511) in the dissection collecting container (55) have one or more to a receiving surface of the dissection collecting container (55) aligned or alignable and independently of a focusing of the microscope objective (41) on the dissection does not move in the dissection collecting container (55) focused or focusable visualization of cameras (91 – 95) on. A corresponding method is likewise the subject matter of the invention.

机译：它是激光显微切割系统（100），是具有反射光装置（76）的显微镜（10），用于通过显微镜（10）的显微镜物镜（41）将激光束（b）聚焦到显微镜上。用于分离物体（51）的装置，以及用于通过聚焦激光束（b）将分离物（511）与物体（51）分离的装置，其中激光显微切割系统（100）还包括用于容纳解剖收集容器的装置提出了一种用于收集粪便（511）的装置（55）和一种用于在解剖收集容器（55）中可视化粪便（511）的装置。用于使解剖收集容器（55）中的检查物（511）可视化的装置具有一个或多个与解剖收集容器（55）的接收表面对准或可对准的位置，并且与显微镜物镜（41）的聚焦无关。解剖不会在解剖收集容器（55）中移动，也不会在聚焦于照相机（91 – 95）的物体上聚焦。相应的方法同样是本发明的主题。

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公开/公告号DE102013209881A1

专利类型
公开/公告日2014-12-04

原文格式PDF
申请/专利权人 LEICA MICROSYSTEMS CMS GMBH;
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申请/专利号DE201310209881
发明设计人 FALK SCHLAUDRAFF;
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申请日2013-05-28
分类号G01N33/48;G02B21/00;G02B21/06;G02B21/32;G01N15/14;G01N1/28;G02B21/24;
国家 DE
入库时间 2022-08-21 14:55:36

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