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THREE-DIMENSIONAL ELECTRONIC PHOTONIC INTEGRATED CIRCUIT FABRICATION PROCESS
THREE-DIMENSIONAL ELECTRONIC PHOTONIC INTEGRATED CIRCUIT FABRICATION PROCESS
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机译：三维电子光子集成电路制造工艺
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摘要
A device and the process for creating a three-dimensional electronic photonic circuit is disclosed. The process includes fabricating a standard high performance integrated circuit on a high resistivity silicon or a silicon-on-insulator substrate up to and including the passivation layer on top of transistors. Separately, a silicon-on-insulator wafer capped by an oxide layer is fabricated, then the two wafers are joined. The resultant device has photonic process elements (e.g. waveguides and photodetectors) fabricated in the top silicon layer. Continued processing interconnects the transistors and photonic elements with contacts and metallization levels to produces an electronic-photonic integrated circuit.
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