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High Density Pyroelectric Thin Film Infrared Sensor Array and Method of Manufacture Thereof
High Density Pyroelectric Thin Film Infrared Sensor Array and Method of Manufacture Thereof
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机译：高密度热释电薄膜红外传感器阵列及其制造方法
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摘要
A method of manufacturing a thermal sensor array comprises: (a) providing a first wafer comprising an integrated circuit; (b) providing a second wafer comprising a carrier substrate, a thermally sensitive layer, a first electrode and a second electrode; (c) applying a polymer to a bonding surface of at least one of the first wafer and the second wafer; (d) contacting the first wafer and the second wafer for a period of time and at a temperature and pressure sufficient to create a bond; (e) removing the carrier substrate; and (f) patterning and etching the thermally sensitive layer, the first electrode and the second electrode to create an array of pixels, wherein the first wafer and the second wafer are bonded without the need for fine alignment of the wafers.
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