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MOLD FOR PRE-PLASTIC-SEALING LEAD FRAMES, PROCESS FOR PRE-PLASTIC-SEALING AND PACKAGING STRUCTURE
MOLD FOR PRE-PLASTIC-SEALING LEAD FRAMES, PROCESS FOR PRE-PLASTIC-SEALING AND PACKAGING STRUCTURE
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机译：塑封前铅模模具，塑封前包装工艺
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摘要
Disclosed in the present invention are a mold for pre-plastic-sealing a lead frame (25), a process for pre-plastic-sealing and a packaging structure, which belong to the field of pressure sensor chip packaging technology. The mold, which is used for pre-plastic-sealing the lead frame (25) of a pressure sensor chip, comprises an upper mold positioned on the first side of the lead frame (25) and a lower mold positioned on the second side of the lead frame (25) opposite the first side. A recess (214) is formed on the surface of the upper mold at the contact face with the first side of the lead frame (25), corresponding to the position of the inner lead of the lead frame (25), so that a raised block stop (252) is formed as the lead frame (25) is forced into the recess (214) by the pressure of the pre-plastic-sealing process. Use of the mold for pre-plastic-sealing keeps the surface of the block stop used for the bonding area from easy contamination and ensures high reliability of lead bonding in the lead frame (25).
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