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Thin film defect inspection for standard board, a method of manufacturing the same, and thin film defect inspection method
Thin film defect inspection for standard board, a method of manufacturing the same, and thin film defect inspection method
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机译:用于标准板的薄膜缺陷检查,其制造方法以及薄膜缺陷检查方法
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摘要
PROBLEM TO BE SOLVED: To provide a standard substrate which enables exact inspection of a defect existing in a thin film formed on a substrate.;SOLUTION: Fine particles 4, 5 having a known particle size and a uniform grading are attached to the surface of a substrate 1 having a clean surface. As such fine particles, fine particles made of polystyrene, polyacrylate, silica or the like, can be used. Subsequently, a thin film is formed on the surface of the substrate in such a state that the fine particles are attached thereto. As a result, the thin film in which the fine particles to get to model defects artificially formed are contained can be obtained. Subsequent to the formation of such a thin film, at least a part of the fine particles are released from the thin film 2 to form defect parts 3. Release of such fine particles can be performed by supersonic cleaning or scrub cleaning. The obtained defect parts 3 become pinholes, having uniform particle sizes in the thin film 2 and parts from which the fine particles are not released become protruded model defects.;COPYRIGHT: (C)2010,JPO&INPIT
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