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METHOD crystal growth of gallium nitride substrate of crystals of gallium nitride epitaxial wafers METHOD FOR PRODUCING AND epitaxial wafers

机译:方法氮化镓外延晶片晶体的氮化镓衬底的晶体生长方法制造和外延晶片

摘要

1. A method of growing a gallium nitride crystal, wherein a carrier gas, a gallium nitride precursor, and a gas containing silicon as a dopant, a gallium nitride crystal is grown on the underlayer by vapor phase epitaxy from hydrides, characterized in that the temperature of the dew point of the carrier gas during the growth of the gallium nitride crystal -60 ° C or below. ! 2. A method for growth a gallium nitride crystal according to claim 1, wherein the partial pressure of the carrier gas during the gallium nitride crystal growth is between 0.56 to 0.92 atm inclusive. ! 3. The substrate of gallium nitride crystals obtained by the process of growth of gallium nitride crystals according to claim 1 or 2, comprising! layer located below the substrate (underlayer); ! gallium nitride crystal formed on the underlayer. ! 4. A method of producing an epitaxial wafer, comprising:! stage of growth of gallium nitride crystal on the GaN sublayer method for crystal growth of claims 1-2; ! the step of removing at least a sublayer to form a substrate consisting of gallium nitride crystal; ! a step of forming epitaxially growing layer on the substrate and! processing step of the substrate surface on the side opposite that on which surface is formed by epitaxially growing the layer for reducing the thickness. ! 5. Epitaxial wafer obtained by a method of producing epitaxial wafers according to claim 4, comprising! and substrate! epitaxially growing a layer formed on the substrate.
机译:1.一种生长氮化镓晶体的方法,其中,通过氢化物的气相外延在底层上生长载气,氮化镓前体和含硅作为掺杂剂的气体,使氮化镓晶体生长在底层上。氮化镓晶体生长期间载气的露点温度为-60℃或更低。 ! 2.根据权利要求1的生长氮化镓晶体的方法,其中在氮化镓晶体生长期间载气的分压在0.56-0.92atm(含)之间。 ! 3.根据权利要求1或2的通过氮化镓晶体的生长过程获得的氮化镓晶体的基板,包括:位于衬底下方的层(底层); !氮化镓晶体形成在底层上。 ! 4.一种生产外延晶片的方法,包括: 3.根据权利要求1-2所述的用于GaN的晶体生长的GaN子层方法上的氮化镓晶体的生长阶段; !去除至少一个子层以形成由氮化镓晶体组成的衬底的步骤; !在衬底上形成外延生长层的步骤,以及!通过外延生长该层以减小厚度,在衬底表面的相反侧上进行衬底表面的处理步骤。 ! 5.通过根据权利要求4所述的制造外延晶片的方法获得的外延晶片,包括:和基材!外延生长在基板上形成的层。

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