首页>
外国专利>
Method and apparatus for integrating low dielectric constant materials into a multilevel metallization and interconnect structure
Method and apparatus for integrating low dielectric constant materials into a multilevel metallization and interconnect structure
展开▼
机译：将低介电常数材料集成到多层金属化和互连结构中的方法和设备
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method and apparatus for protecting a metal interconnect from corrosion due to contact with a low k dielectric material in a multilevel metallization and interconnect structure. To facilitate such protection, a barrier material, in the form of a sidewall spacer, is deposited between the dielectric material and the metal line.
展开▼
