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COLD-CURABLE RESIN COMPOSITION, COLD-CURING TYPE ADHESIVE, REACTIVE HOT-MELT TYPE ADHESIVE AND COLD-CURING TYPE TACKY AGENT
COLD-CURABLE RESIN COMPOSITION, COLD-CURING TYPE ADHESIVE, REACTIVE HOT-MELT TYPE ADHESIVE AND COLD-CURING TYPE TACKY AGENT
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机译：冷固化树脂组合物，冷固型胶粘剂，活性热熔型胶粘剂和冷固型胶粘剂
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摘要
PROBLEM TO BE SOLVED: To obtain a cold-curable resin composition which comprises an epoxy compound and an oxazolidine compound, shows excellent adhesion to a variety of substrate materials and storage stability as a one-pack type, is curable without operations such as heating, irradiation with light or the like and is useful as a liquid-type reactive adhesive and the like. ;SOLUTION: This cold-curable resin composition contains (A) an epoxy compound, (B) an oxazolidine of the formula (R1 is a straight-chain, branched chain or cyclic 1-22C hydrocarbon group; R2 is H, methyl, ethyl, isopropyl, isoamyl, phenyl; (n) is 2-4), when necessary, in addition, (C) a thermoplastic resin or a tackifier resin or (D) a hydrolyzable silyl group-containing resin and its curing catalyst.;COPYRIGHT: (C)1997,JPO
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机译：解决的问题：为了获得一种包含环氧化合物和恶唑烷化合物的冷固性树脂组合物，它对多种基材具有优异的粘合性，并且作为一包式的产品具有储存稳定性，无需加热即可进行固化，用光等照射，可用作液体型反应性粘合剂等。 ;解决方案：这种冷固性树脂组合物包含（A）环氧化合物，（B）式（R 1 为直链，支链或环状1-22C烃基的恶唑烷; R 2 是H，甲基，乙基，异丙基，异戊基，苯基;（n）是2-4），必要时，（C）热塑性树脂或增粘树脂或（ D）一种可水解的含甲硅烷基树脂及其固化催化剂。;版权所有：（C）1997，日本特许厅
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