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Epitaxial wafer manufacturing method and epitaxial wafer

机译:外延晶片制造方法和外延晶片

摘要

To provide a manufacturing method of an epitaxial wafer capable of manufacturing an epitaxial wafer having an epitaxial layer excellent in flatness.SOLUTION: A manufacturing method of an epitaxial wafer according to the present invention includes a first step (steps S1 to S3) of subsequently placing a wafer on a susceptor after supporting the wafer carried into a chamber by a lift pin, a second step (step S4) of raising the temperature in the chamber, a third step (steps S5 to S6) of measuring the temperature of the front surface and the back surface of the wafer and confirming whether the temperature difference is 10°C or less, a fourth step (steps S7 to S8) of supporting the wafer again by the lift pin when the temperature difference becomes 10°C or less, and subsequently placing the wafer on the susceptor again, and a fifth step (step S9) of obtaining an epitaxial wafer by epitaxial growth.SELECTED DRAWING: Figure 4
机译:提供一种外延晶片的制造方法,该外延晶片能够制造具有平坦度优异的外延层的外延晶片。溶解:根据本发明的外延晶片的制造方法包括随后放置的第一步骤(步骤S1至S3)在通过提升销支撑晶片后,基座上的晶片通过提升销,第二步(步骤S4)升高腔室中的温度,第三步(步骤S5至S6)测量前表面的温度和晶片的后表面并确认温度差是否为10°C或更低,当温度差变为10°C或更小时,通过提升销再次支撑晶片的第四步(步骤S7至S8)。随后再次将晶片放置在基座上,第五步(步骤S9)通过外延生长获得外延晶片。选择的绘图:图4

著录项

  • 公开/公告号JP6844529B2

    专利类型

  • 公开/公告日2021-03-17

    原文格式PDF

  • 申请/专利权人 株式会社SUMCO;

    申请/专利号JP20170252003

  • 发明设计人 和田 直之;山口 浩司;中村 郁浩;

    申请日2017-12-27

  • 分类号H01L21/205;C23C16/52;C30B29/06;C30B25/12;H01L21/683;

  • 国家 JP

  • 入库时间 2022-08-24 17:44:11

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