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Surface charging effects on current stability of AlGaN/GaN HEMTs

机译:表面充电对AlGaN / GaN HEMT电流稳定性的影响

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Using a dual-gate transistor structure, we have evaluated the effect of off-bias-stress spatially induced surface charging at the AlGaN/GaN surface. Pulsed voltage stress on the drain access region led only to increase in the on-resistance, whereas the stress on the source region additionally decreased the saturation drain current. In addition, significant surface charging in the access region resulted in a threshold voltage shift. The 2D potential simulation indicated that surface negative charges modulate the potential distribution near the gate edge. It was also found that such surface charging can extend as far as 0.5 μm from the stressing gate edge.
机译:使用双栅晶体管结构,我们已经评估了偏偏置应力在空间上引起的AlGaN / GaN表面电荷的影响。漏极访问区上的脉冲电压应力仅导致导通电阻增加,而源极区上的应力另外降低了饱和漏极电流。此外,访问区域中的大量表面电荷导致阈值电压偏移。二维电势模拟表明,表面负电荷可调节栅极边缘附近的电势分布。还发现,这种表面电荷可以从应力栅极边缘延伸多达0.5μm。

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