首页> 外文会议>2nd International EUSPEN Conference on Precision Engineering Nanotechnology Vol.1, May 27th-31st, 2001, Turin, Italy >New Maskless Micro-Fabrication Technique of Single-crystal Silicon using the Combination of Nanometer-scale Machining and Wet Etching
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New Maskless Micro-Fabrication Technique of Single-crystal Silicon using the Combination of Nanometer-scale Machining and Wet Etching

机译:纳米加工与湿法刻蚀相结合的单晶硅无掩模微细加工新技术

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摘要

This paper describes a new maskless micro-fabrication technique using the combination of nanometer-scale mechanical machining and wet etching. First, the (100) surface of a single-crystal silicon is machined by using the nano-machining system, which utilises the mechanism of the friction force microscope (FFM.) Next, the material is etched by KOH solution. After the etching process, the convex structure or deeper hole is made because of the masking or promotion effect of the affected layer generated by nano-machining. To investigate this interesting effect, the affected layer was analysed. Moreover, some test structures were fabricated by using the masking effect.
机译:本文介绍了一种结合了纳米级机械加工和湿法蚀刻技术的新型无掩模微加工技术。首先,利用纳米加工系统对单晶硅的(100)表面进行加工,该系统利用了摩擦力显微镜(FFM)的机理。其次,该材料被KOH溶液蚀刻。在蚀刻工艺之后,由于纳米加工产生的受影响层的掩蔽或促进作用,形成了凸结构或更深的孔。为了研究这种有趣的效果,分析了受影响的层。此外,利用掩蔽效应制造了一些测试结构。

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