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首页> 外文会议>42nd international symposium on microelectronics (IMAPS 2009) >Deposition of Thick Film Fine Line Patterns by Direct Writing
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Deposition of Thick Film Fine Line Patterns by Direct Writing

机译：通过直接写入沉积厚膜细线图案

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摘要

The process of the direct deposition of thick film materials (somewhere known as direct writing) on ceramicrnand silicon substrates was investigated. Some newly achieved findings and results are described in this paper.rnSuch approach was chosen as a low cost and prompt alternative for deposition of thick film pastes, especially byrnlow volume batches. The use is for hybrid IC's, as well as for a wide range of non-conventional applications (forrnexample for front side of solar cells, antennas, CSP interposers etc.). This relatively new technique offersrnsignificant cost and time benefits across a wide spectrum of applications because it eliminates expensive masksrnand tools. Developed at Brno University of Technology is reasonable and no expensive equipment for directrnwriting deposition with basic characteristics somewhere between the dispensing and the jetting technique. Thisrnequipment consists of a plotter drive unit with dispensing head (with z axis motion) which is situated beyond thernx, y axis table, and a control unit with software capable to process CAD data. The substantial part of the head isrnthe z axis holder with syringe and dispensing nozzle. The paste is extruded through a hollow needle, working asrna non contact dispense nozzle. Z axis motion is required when the head moves down to the paste transferrnposition and after pattern completion moves up to the starting position. Paste viscosity including temperaturernconditions, pressure in the cartridge, speed of the nozzle and distance between the nozzle and substrate are thernmost important parameters for achieve the optimal setting and resulting paste transfer reproducibility. That is thernreason why we investigate in more detail the paste transfer which depends essentially on paste viscosity.rnObviously constant pressure, optional heating of the cartridge and constant movement of either the needle or thernsubstrate also have a significant impact on the uniform and homogeneous paste transfer. Various materials underrnvarious process conditions are applied to achieve favourable results with good quality and reproducibility.rnSubsequently, the shape of the deposited layer has been observed, measured and evaluated. Also electricalrnproperties of the deposited conductor materials were evaluated.
机译：研究了在陶瓷和硅衬底上直接沉积厚膜材料（在某些地方称为直接写入）的过程。本文描述了一些新近取得的发现和结果。这种方法被选择为低成本且迅速替代厚膜浆料沉积的方法，尤其是对于小批量生产。该用途可用于混合IC，以及广泛的非常规应用（例如太阳能电池，天线，CSP中介层等的正面）。这种相对较新的技术消除了昂贵的掩模和工具，因此在广泛的应用范围内提供了可观的成本和时间收益。布尔诺工业大学开发的设备合理，并且没有昂贵的用于直接沉积沉积的设备，其基本特征介于点胶和喷射技术之间。该设备由一个绘图仪驱动单元和一个控制单元组成，该绘图仪驱动单元具有位于r，x和y轴工作台之外的分配头（具有z轴运动），以及一个具有能够处理CAD数据的软件的控制单元。头部的主要部分是带有注射器和分配喷嘴的z轴支架。糊状物通过空心针，非接触式工作分配喷嘴挤出。当打印头向下移动到焊膏转移位置并且图案完成后向上移动到起始位置时，需要Z轴运动。糊剂的粘度包括温度条件，料筒中的压力，喷嘴的速度以及喷嘴与基材之间的距离是实现最佳设置和最终糊剂转移重现性的最重要参数。这就是为什么我们要更详细地研究主要取决于糊剂粘度的糊剂转移的原因。显然，恒定的压力，可选的药筒加热以及针头或基材的恒定运动也对均匀和均质的糊剂转移产生重大影响。在各种工艺条件下使用各种材料以获得良好的质量和可重复性的良好结果。随后，已观察，测量和评估了沉积层的形状。还评估了沉积的导体材料的电性能。

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  • 来源
  • 会议地点 San Jose CA(US);San Jose CA(US)
  • 作者

    Martin Bursik; Jirí Hladík; Ivan Szendiuch;

  • 作者单位

    Department of Microelectronics, Faculty of Electrical Engineering and Comunication TechnologyrnBrno University of Technology Udolni 53, Brno 602 00, Czech Republic,rnPhone +420 541146158, fax: +420 541146298;

    rnDepartment of Microelectronics, Faculty of Electrical Engineering and Comunication TechnologyrnBrno University of Technology Udolni 53, Brno 602 00, Czech Republic,rnPhone +420 541146158, fax: +420 541146298;

    rnDepartment of Microelectronics, Faculty of Electrical Engineering and Comunication TechnologyrnBrno University of Technology Udolni 53, Brno 602 00, Czech Republic,rnPhone +420 541146158, fax: +420 541146298, szend@feec.vutbr.cz;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 微电子学、集成电路（IC）;
  • 关键词

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