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首页> 外文会议>Advances in Resist Technology and Processing XXIII pt.1 >Solid Defects Condensation during Watermark Formation for Immersion Lithography
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Solid Defects Condensation during Watermark Formation for Immersion Lithography

机译：浸没式光刻水印形成过程中的固体缺陷冷凝

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摘要

In immersion lithography technique, some defects such as a watermark and a nanoscale bubble have been focused as the serious problems to be solved. In order to clarify the formation mechanism of the watermark, the in-situ observation of the drying behavior of the water drop containing the particles and without the particles, are conducted on the Si substrates. In the static watermark formation on the flat substrate, we can classify the watermark formation processes based on the watermark shapes. From the surface energy balance analysis, the particles dispersed in the DI-water adhere on the Si substrate. In addition, from the Laplace force balance, the particles adhered on the Si substrate will attract the surrounding particles. Hence, we can clarify the formation mechanism of the static watermark condensed in the ring shape. Meanwhile, in the dynamic watermark formation, we can observe clearly the condensed watermark is formed on the Si substrate and the particles move to lower region in inclined drop. In actual immersion lithography system, we can discuss the particles are more likely to remain in the immersion liquid under the lens system.
机译：在浸没式光刻技术中，诸如水印和纳米级气泡之类的一些缺陷已被集中作为要解决的严重问题。为了阐明水印的形成机理，在Si衬底上对包含颗粒而没有颗粒的水滴的干燥行为进行原位观察。在平坦基板上的静态水印形成中，我们可以基于水印形状对水印形成过程进行分类。通过表面能平衡分析，分散在去离子水中的颗粒附着在Si衬底上。另外，通过拉普拉斯力平衡，粘附在Si衬底上的颗粒将吸引周围的颗粒。因此，我们可以澄清浓缩成环形的静态水印的形成机理。同时，在动态水印形成中，我们可以清楚地观察到凝结的水印在Si衬底上形成，并且粒子以倾斜的液滴的形式移动到下部区域。在实际的浸没式光刻系统中，我们可以讨论在透镜系统下更可能残留在浸没液体中的颗粒。

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