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首页> 外文会议>CMP-MIC Catalog no.05 IMIC - 1000P; International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference(CMP-MIC); 20050223-25; Fremont,CA(US) >A STUDY ON THE CUTTING PHENOMENA OF THE PAD USED IN CMP PROCESS BY SINGLE DIAMOND GRIT
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A STUDY ON THE CUTTING PHENOMENA OF THE PAD USED IN CMP PROCESS BY SINGLE DIAMOND GRIT

机译：单金刚石砂磨CMP工艺中PAD切割现象的研究

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摘要

Surface texture of a pad is one of the major factors influencing the stable material removal rate (MRR), surface defects and uniformity of wafers in CMP process. Pad conditioning by a diamond disk dresser would remove the agglomerates and glazed areas on pad surface generated in CMP process, and consequently keep stable polishing rate of wafers and extend pad life. In order to realize the influence of pad conditioning on surface texture of a pad, experiments of a pad scratched by single diamond grit is carried out in this paper. The relationships between the penetration depth and two types of cutting mechanism, namely, Point-cutting and Edge-cutting, are investigated. The cross-sectional profiles of the scratch on pad surface under different penetration depths and relative cutting velocities are measured by a surface profiler. The normalized uphill ratio (NUR) is used to evaluate the ploughing influence of single diamond grit cutting on pad surface texture. The results show that when penetration depth of diamond grit is larger than a critical value, the depth of scratch decreases as relative cutting velocity increases. NUR is less than one and has a maximum value as diamond grit with about 50° back rake angle in Point-cutting, but there is no explicit relationship between NUR and relative cutting velocity both in Point-cutting and Edge-cutting.
机译：垫的表面纹理是影响CMP工艺中稳定材料去除率（MRR），表面缺陷和晶片均匀性的主要因素之一。用金刚石圆盘修整器进行的抛光垫处理将去除CMP工艺中在抛光垫表面上产生的附聚物和釉面区域，从而保持晶片的稳定抛光速度并延长抛光垫寿命。为了实现垫修整对垫表面纹理的影响，本文进行了单金刚石磨料刮擦垫的实验。研究了切入深度与两种切削机理之间的关系，即点切和边切。通过表面轮廓仪测量在不同穿透深度和相对切削速度下的垫表面上的划痕的横截面轮廓。使用归一化的上坡比（NUR）来评估单颗金刚石砂砾切削对垫块表面纹理的犁削影响。结果表明，当金刚石砂粒的穿透深度大于临界值时，随着相对切削速度的增加，划痕深度减小。 NUR小于1，并且在切点时具有约50°的后前角的金刚石砂粒具有最大值，但在切点和切边时NUR与相对切削速度之间没有明确的关系。

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