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首页> 外文会议>Conference on Challenges in Process Integration and Device Technology 18-19 September 2000 Santa Clara, USA >Design and Process issues affecting performance of optical interconnects on ICs,
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Design and Process issues affecting performance of optical interconnects on ICs,

机译：影响IC上光学互连性能的设计和工艺问题，

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摘要

With the exponential increase in device densities and operating speeds, further improvements in chip performance are more difficult to achieve due to the physical limitations of conventional interconnects. Optical interconnects provide one of the solutions to continue improving performance of future technologies. Unlike other optical systems, the proposed approach requires minimal changes in conventional fabrication process. Other major barriers to industry-wide acceptance are perceived limitations in performance. In this research, models have been developed to show that the performance of optical interconnects is a strong function of technology and layout.
机译：随着设备密度和操作速度的指数增长，由于常规互连的物理局限性，更难以实现芯片性能的进一步改善。光学互连是继续改善未来技术性能的解决方案之一。与其他光学系统不同，所提出的方法在常规制造过程中所需的更改最少。整个行业接受的其他主要障碍是性能限制。在这项研究中，已经开发出模型来表明光学互连的性能是技术和布局的强大功能。

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