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Generalization of the photo process window and its application to OPC test pattern design

机译：照片处理窗口的一般化及其在OPC测试图案设计中的应用

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From the early development phase up to the production phase, test pattern play a key role for microlithography. The requirement for test pattern is to represent the design well and to cover the space of all process conditions, e.g. to investigate the full process window and all other process parameters. This paper shows that the current state-of-the-art test pattern do not address these requirements sufficiently and makes suggestions for a better selection of test pattern. We present a new methodology to analyze an existing layout (e.g. logic library, test pattern or full chip) for critical layout situations which does not need precise process data. We call this method "process space decomposition", because it is aimed at decomposing the process impact to a layout feature into a sum of single independent contributions, the "dimensions" of the process space. This is a generalization of the classical process window, which examines defocus and exposure dependency of given test pattern, e.g. CD value of dense and isolated lines. In our process space we additionally define the dimensions resist effects, etch effects, mask error and misalignment, which describe the deviation of the printed silicon pattern from its target. We further extend it by the pattern space using a product based layout (library, full chip or synthetic test pattern). The criticality of pattern is defined by their deviation due to aerial image, their sensitivity to the respective dimension or several combinations of these. By exploring the process space for a given design, the method allows to find the most critical patterns independent of specific process parameters. The paper provides examples for different applications of the method: (1) selection of design oriented test pattern for lithography development (2) test pattern reduction in process characterization (3) verification/optimization of printability and performance of post processing procedures (like OPC) (4) creation of a sensitive process monitor.
机译：从早期开发阶段到生产阶段，测试图案在微光刻中起着关键作用。测试图案的要求是要很好地表示设计并覆盖所有过程条件的空间，例如调查整个过程窗口和所有其他过程参数。本文表明，当前的最新测试模式不能充分满足这些要求，并提出了更好选择测试模式的建议。我们提出了一种新的方法来分析现有布局（例如逻辑库，测试模式或全芯片），以用于不需要精确过程数据的关键布局情况。我们将此方法称为“过程空间分解”，因为它旨在将对布局特征的过程影响分解为单个独立贡献的总和，即过程空间的“维度”。这是经典处理窗口的概括，它检查了给定测试图案（例如，密集线和孤立线的CD值。在我们的处理空间中，我们还定义了抗蚀剂效应，蚀刻效应，掩模误差和未对准的尺寸，这些尺寸描述了印刷硅图案与其目标的偏差。我们使用基于产品的布局（库，全芯片或合成测试图案）通过图案空间进一步扩展它。图案的关键性取决于它们由于航拍图像而引起的偏差，它们对相应尺寸的敏感度或它们的几种组合。通过探索给定设计的过程空间，该方法可以找到独立于特定过程参数的最关键的模式。本文为该方法的不同应用提供了示例：（1）选择用于光刻开发的面向设计的测试图案（2）减少工艺特性中的测试图案（3）验证/优化可印刷性和后处理程序的性能（如OPC） （4）创建敏感的过程监视器。

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