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High Dose Implantation Impact on the Carrier Mobility in Ultra-Thin Unstrained and Strained SOI Films

机译:大剂量植入对超薄无应变和应变SOI薄膜载流子迁移的影响

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摘要

Based on electrical measurements and transmission election microscopy imaging we propose in this paper a possible explanation for the measured mobility degradation with gate length reduction in short-channel MOSFETs. The carrier mobility in end-of-range implantation regions was investigated in Silicon-On-Insulator (SOI) and tensily-strained Silicon-On-Insulator (sSOI) substrates. Wafers with ultrathin films (from 8 to 35 nm) were Ge implanted at various concentrations, then annealed. The Pseudo-MOSFET measurements showed a mobility decrease (from 5 to 34%) as the implantation dose increased. The results are relevant for the optimization of the sources and drains regions of advanced nano-scale SOI transistors.
机译:基于电学测量和透射电子显微镜成像,我们在本文中提出了一种可能的解释,即随着短沟道MOSFET栅极长度的减小,迁移率降低。在绝缘体上硅(SOI)和受拉应变的绝缘体上硅(sSOI)衬底中研究了射程结束注入区域中的载流子迁移率。将具有不同浓度的Ge薄膜(8至35 nm)注入,然后进行退火。伪MOSFET的测量结果表明,随着注入剂量的增加,迁移率降低(从5%降至34%)。结果与优化先进的纳米级SOI晶体管的源极和漏极区域有关。

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