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首页> 外文会议>International conference on soldering and reliability 2008 >CHARACTERISTICS OF Sn-Ag-Cu-In QUATERNARY SOLDER COMPOSITIONS AND RELIABILITY EVALUATION OF THE SOLDER JOINTS
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CHARACTERISTICS OF Sn-Ag-Cu-In QUATERNARY SOLDER COMPOSITIONS AND RELIABILITY EVALUATION OF THE SOLDER JOINTS

机译：Sn-Ag-Cu-In四方钎料组成特征及焊点可靠性评估

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摘要

This study proposes a quaternary (i.e. Sn-Ag-Cu-In) solder alloy to replace the conventional Pb-free solder alloy of Sn-3.0Ag-0.5Cu composition. For this purpose, the proportion of In and Ag-expensive elements among the ingredients added-is minimized and optimized. The composition suggested in this study, Sn-1.2Ag-0.5Cu-0.4In, has better wetting properties than Sn-3.0Ag-0.5Cu. Its mechanical properties and reactions to the under bump metallurgy (UBM) are improved, and hence it shows high reliability when used as a soldering material. Against this backdrop, this new Pb-free solder composition is expected to serve as a replacement for the Sn-3.0Ag-0.5Cu composition.
机译：这项研究提出了一种四元（即Sn-Ag-Cu-In）焊料合金来代替传统的Sn-3.0Ag-0.5Cu组成的无铅焊料合金。为此目的，使添加的成分中In和Ag昂贵的元素的比例最小化和优化。本研究中建议的组成Sn-1.2Ag-0.5Cu-0.4In具有比Sn-3.0Ag-0.5Cu更好的润湿性能。它的机械性能和对凸点下冶金（UBM）的反应得到改善，因此在用作焊接材料时显示出很高的可靠性。在这种背景下，这种新的无铅焊料组合物有望替代Sn-3.0Ag-0.5Cu组合物。

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