首页> 外文会议>Lithography for Semiconductor Manufacturing >Effect of photoresist contrast on intrafield critical dimensions in sub-half-micron optical lithography
【24h】

Effect of photoresist contrast on intrafield critical dimensions in sub-half-micron optical lithography

机译:亚半微米光刻中光刻胶对比度对场内临界尺寸的影响

获取原文
获取原文并翻译 | 示例

摘要

Abstract: Resist contrast is related to usable depth-of-focus (UDOF) for I-line and DUV stepper lenses through the resists process linearity function. Results, supported by simulations in the resist image, show that stepper field center-edge critical dimensional offsets, which decrease UDOF, increase as resist contrast decreases. Measurements on intra-field CDs show that their uniformity decreases as processes reach non-linear processing regimes. !3
机译:摘要:抗蚀剂对比度通过抗蚀剂工艺线性函数与I线和DUV步进透镜的可用焦深(UDOF)有关。抗蚀剂图像中的仿真结果支持的结果表明,随着抗蚀剂对比度的降低,降低UDOF的步进场中心边缘临界尺寸偏移会增加。对场内CD的测量表明,其均匀性会随着过程达到非线性处理机制而降低。 !3

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号