首页> 外文会议> >Sensitivity Investigation of Substrate Thickness and Reflow Profile on Wafer Level Film Failures in 3D Chip Scale Packages by Finite Element Modeling
【24h】

Sensitivity Investigation of Substrate Thickness and Reflow Profile on Wafer Level Film Failures in 3D Chip Scale Packages by Finite Element Modeling

机译:有限元建模对3D芯片级封装中晶圆厚度和回流厚度对晶圆厚度薄膜回流敏感性的敏感性研究

获取原文

摘要

3D chip scale package (CSP) is one of the major trends in IC packaging with the application of wafer level films (WLF) for die-to-die or die-to-substrate attachment. However, the WLF failures (voiding/cracking) are often observed in moisture sensitivity test. Substrate thickness and reflow profile were found very sensitive to the WLF failure rate. To investigate the sensitivity of the substrate thickness and the reflow profile, a novel direct concentration approach (DCA) is developed in this study, which allows updating the interfacial continuous condition as the function of the temperature and humidity. The paper also develops a simplified micromechanics-based vapor pressure model to visualize the whole-field vapor pressure corresponding to the instantaneous moisture distribution. With the applications of the DCA and the simplified vapor pressure model to a 3D ultra-thin stacked-die CSP, it was found that the moisture transport and escape during the reflow is the root cause of the WLF failures. A small reduction of the substrate thickness and an in-situ baking during the reflow can reduce greatly the moisture concentration and the vapor pressure at the bottom film, and therefore significantly decrease the WLF failure rate.
机译:3D芯片级封装(CSP)是IC封装的主要趋势之一,其应用是将晶片级薄膜(WLF)用于管芯对管芯或管芯对基板的附着。但是,在水分敏感性测试中经常观察到WLF失效(空洞/裂纹)。发现基板厚度和回流曲线对WLF失效率非常敏感。为了研究基板厚度和回流曲线的敏感性,本研究开发了一种新颖的直接浓缩法(DCA),该方法可根据温度和湿度的变化更新界面连续条件。本文还开发了一个简化的基于微力学的蒸气压模型,以可视化对应于瞬时水分分布的全场蒸气压。通过将DCA和简化的蒸气压模型应用于3D超薄叠模CSP,发现回流期间的水分输送和逸出是WLF故障的根本原因。基板厚度的少量减小和回流期间的原位烘烤可大大降低底膜处的水分浓度和蒸气压,从而显着降低WLF的故障率。

著录项

  • 来源
    《》|2007年|242-248|共7页
  • 会议地点
  • 作者

    Xie; Bin; Shi; Xunqing; Fan; Xuejun;

  • 作者单位
  • 会议组织
  • 原文格式 PDF
  • 正文语种
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号