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首页> 外文会议>2010 the 5th IEEE Conference on Industrial Electronics and Applications >Application of image processing to wafer probe mark area calculation
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Application of image processing to wafer probe mark area calculation

机译：图像处理在晶圆探针标记面积计算中的应用

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This paper presents an image processing approach that calculates the probe mark area on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. Traditionally, given the difficulty of calculating the area of the irregular probe mark, probe mark area calculations were substituted by calculating the area of the oval that is manually drawn to cover the probe mark area. Nevertheless, this method is inaccurate, and the results varied from person to person. In this paper, we present an imaging processing approach to calculate the probe mark area utilizing high magnification microscopes to capture probe mark images. Our approach is faster and more accurate compared to traditional methods.
机译：本文提出了一种图像处理方法，可以计算出半导体晶圆焊盘上的探针标记面积。在引线键合到晶圆之前，必须使用探针测试芯片焊盘的电特性。但是，该测试会在焊盘上留下探针痕迹。较大的探针痕迹面积会导致在焊盘的焊球处产生较弱的粘附力，从而导致产生不良的产品。传统上，由于难以计算不规则探针标记的面积，因此通过计算手动绘制以覆盖探针标记区域的椭圆形的面积来代替探针标记面积的计算。但是，此方法不准确，结果因人而异。在本文中，我们提出了一种成像处理方法，利用高倍率显微镜来捕获探针标记图像，从而计算出探针标记区域。与传统方法相比，我们的方法更快，更准确。

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