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首页> 外文会议>Conference on millimeter, submillimeter, and far-infrared detectors and instrumentation for astronomy >From an MMIC chip to a working cryogenic low-noise amplifier: a detailed study on packaging
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From an MMIC chip to a working cryogenic low-noise amplifier: a detailed study on packaging

机译：从MMIC芯片到工作低音低噪声放大器：包装的详细研究

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Cryogenic Low Noise Amplifiers, based on MMIC HEMT technology, require a careful packaging to reach optimalperformance. Differences between modeled and measured performance can often be related to chip mounting details. Inthe framework of the development of new cryogenic LNAs, described in a companion paper, we have developed aspecific packaging to host W-band cryogenic MMIC LNAs. We present here some of the main factors analyzed in thedesign and chip integration activities. In particular, mechanical and thermal modeling, LNA chip gluing and adhesiveproperties, sensitivity to components integration accuracy (i.e. deviation from the ideal orientation). Preliminary testresults are also reported.© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
机译：基于MMIC HEMT技术的低温低噪声放大器需要仔细的包装来达到最佳效果。建模和测量性能之间的差异通常可以与芯片安装细节有关。新型低温LNA的开发框架框架，在伴侣纸上描述，我们已经开发出了托管W波段低温MMIC LNA的缺乏包装。我们在这里展示了一些主要因素，分析了基调和芯片集成活动。特别地，机械和热建模，LNA芯片胶合和粘合剂，对组件的敏感性集成精度（即偏离理想方向）。还报告了初步测试结果。©（2012）版权协会照片光学仪表工程师（SPIE）。仅供个人使用的摘要下载。

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