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A crosstalk avoidance scheme based on re-layout of signal TSV

机译：基于信号TSV重新布局的避免串扰方案

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TSV (Through-silicon Via) is applied to 3D integrated circuits, which meets the demands of high speed and low power consumption. However, high density of TSV implementation exacerbates crosstalk noise which will reduce the transmission reliability. Due to temporal and spatial locality of signal transmission, some signal TSVs can be used for shielding. In this paper, we propose a crosstalk avoidance scheme based on re-layout of signal TSV. Two parameters, crosstalk index and unshielded index, are proposed in this paper to describe the shielding effect of signal TSV re-layout. Both of the indexes are optimized by using non-dominated sorting genetic algorithm II (NSGA-II). We implemented our scheme based on SPEC2006 trace-driven simulation. Result shows that the number of transmission patterns that cause worst crosstalk decreases by 28.8%. And transmission time is reduced by 14.8%. Compared with other algorithms, our work achieves the same or even better results without redundancy TSVs.
机译：TSV（硅直通孔）应用于3D集成电路，可满足高速和低功耗的需求。但是，TSV实施的高密度加剧了串扰噪声，这将降低传输可靠性。由于信号传输的时间和空间局部性，某些信号TSV可以用于屏蔽。在本文中，我们提出了一种基于信号TSV重新布局的串扰避免方案。本文提出了两个参数，即串扰指数和非屏蔽指数，以描述信号TSV重新布局的屏蔽效果。通过使用非支配排序遗传算法II（NSGA-II）对这两个指标进行了优化。我们基于SPEC2006跟踪驱动的仿真实施了我们的方案。结果表明，导致最严重串扰的传输模式数量减少了28.8％。并且传输时间减少了14.8％。与其他算法相比，我们的工作在没有冗余TSV的情况下可以达到相同甚至更好的结果。

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