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Sensitivity analysis for SoC performance benchmark against interconnect parasitic resistance and capacitance beyond 10-nm FinFET technology

机译:互连寄生电阻和电容超越10nm FinFET技术的SoC性能基准的敏感性分析

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This paper discusses the performance impact of interconnect parasitic resistance and capacitance for SoC (System on Chip) design beyond 10-nm FinFET technology. As technology scaling advances, the impact of BEOL (Back End of Line) is recognized as one influencer on operating performance. Using typical logic standard cells, sensitivity analysis by DOE (Design of Experiments) shows that the parasitic resistance on wire loads makes a large impact on the cell propagation delay especially with strong cell drivability. Multiple benchmarks show the same tendency that operating performance is degraded by parasitic resistance when strong drivability cells are engaged.
机译:本文讨论了互连寄生电阻和SoC(芯片)设计电容的性能影响超出了10nm FinFET技术。随着技术缩放的进步,BEOL(线路后端)的影响被认为是一个对操作性能的影响因素。使用典型的逻辑标准单元,DOE的灵敏度分析(实验设计)表明,线材负荷对电池传播延迟的寄生电阻尤其是具有强大的细胞驱动性。多个基准测试表明,当强化性电池接合时,通过寄生电阻降低运行性能的趋势。

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