Direct-bonding and flip-chip bonding technologies applied toSi/PLZT spatial light modulator fabrication

机译：直接键合和倒装芯片键合技术应用于Si / PLZT空间光调制器制造

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A versatile technology to graft thin (~2 μm thick) Si circuitlayers onto a new host substrate by substrate removal and direct bonding(SR/DB) is presented. This technology has been combined with aself-aligning low-temperature flip-chip bonding technology to fabricatea hybrid Si/PLZT smart spatial light modulator structure consisting of ahigh voltage driver circuit array, foundry-processed logic chip, andferroelectric PLZT substrate. Thin Si detectors (1 μm thick) withquantum efficiency of ~0.80 has also been implemented in thedirect-bonded driver circuit to allow each pixel to be addressedoptically. The SR/DB technology can also be applied to bond thin circuitlayers onto substrates of any type or shape that may be useful forelectronic packaging

机译：一种多功能技术，以脱皮薄（〜2μm厚）Si电路通过基板去除和直接粘合在新的宿主基板上（SR / DB）提出。这项技术已与a相结合自对准低温倒装芯片粘接技术制造一种由a的混合SI / PLZT智能空间光调制结构组成高压驱动电路阵列，铸造加工逻辑芯片，和铁电PLZT基板。薄Si探测器（1μm厚）量子效率〜0.80也已实施直接绑定驱动电路，以允许每个像素寻址光学。 SR / DB技术也可以应用于粘合薄电路层叠在任何类型或形状的基板上，这可能是有用的电子包装

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《Electronic Components and Technology Conference, 1995. Proceedings., 45th》||p.194-200|共7页
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Jin M.S.; Wang J.H.; Lu D.T.; Ozguz V.; Lee S.H.;
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1. Fabrication of bottom-emitting organic light-emitting diode panels interconnected with encapsulation substrate by Au-Au flip-chip bonding and capillary-driven filling process [J] . Yamada S., Shim C. -H., Edura T., Microelectronic Engineering . 2016,第Auga期

机译：通过Au-Au倒装芯片键合和毛细管驱动填充工艺制造与封装基板互连的底部发光有机发光二极管面板
2. Investigation of radiation characteristics of a nd: YAG laser with an intracavity spatial-time light modulator on the basis of electrooptical PLZT ceramics [J] . Alekseev V.N., Kotylev V.N., Liber V.I. Квантовая электроника . 1999,第3期

机译：基于电光PLZT陶瓷的带腔内时空调制器的nd：YAG激光器的辐射特性研究
3. Deposition and characterization of thin ferroelectric lead lanthanum zirconate titanate (PLZT) films on sapphire for spatial light modulators applications [J] . Krishnakumar S., Ozguz V.H. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control . 1991,第6期

机译：蓝宝石上铁电锆钛酸镧钛酸铅（PLZT）薄膜的沉积和表征，用于空间光调制器应用
4. Direct-bonding and flip-chip bonding technologies applied to Si/PLZT spatial light modulator fabrication [C] . Jin, M.S., Wang, Electronic Components and Technology Conference, 1995. Proceedings., 45th . 1995

机译：直接键合和倒装芯片键合技术应用于Si / PLZT空间光调制器制造
5. Laser recrystallized silicon/PLZT smart spatial light modulators for optoelectronic computing. [D] . Ersen, Ali. 1992

机译：激光重结晶硅/ PLZT智能空间光调制器，用于光电计算。
6. Phosphor-Free InGaN White Light Emitting Diodes Using Flip-Chip Technology [O] . Ying-Chang Li, Liann-Be Chang, Hou-Jen Chen, 2017

机译：使用倒装芯片技术的无磷InGaN白光发射二极管
7. Feasibilities on Microthin Underfill Technologies for Gap Less than 10.MU.m Applied to Flip-Chip Bonding in 20.MU.m Pitch. [O] . Yoshihiro TOMITA, Tatsuya ANDO, Naotaka TANAKA, 2001

机译：MICRIN底部填充技术的缺陷技术缺少少于10.M.m在20mu.m球场上施加到倒装芯片粘合。

Direct-bonding and flip-chip bonding technologies applied toSi/PLZT spatial light modulator fabrication

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