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Deposition and characterization of Schottky and Ohmic contacts on n-type alpha (6H)SiC (0001)

机译:N型α(6H)SiC上肖特基和欧姆触点的沉积和表征SiC(0001)

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The electrical behavior and the interfacial chemistry and microstructure have been determined for the Ti, Pt, Hf, and Co/6H-SiC systems. Deposited in their pure form onto unheated, n-type, chemically-cleaned substrates via UHV electron beam evaporation, the metals formed excellent rectifying contacts with ideality factors below 1.1 and leakage currents as low as 2× 10~(-8 )A/cm~2 at -10 V. Titanium, Pt, and Hf remained rectifying after annealing at 700 - 750°C; Co became ohmic-like after heating to 1000°C. Substantial inter-diffusion and phase evolution occurred at each metal/SiC interface during the anneals.
机译:用于Ti,Pt,HF和Co / 6H-SiC系统确定了电力行为和界面化学和微观结构。通过UHV电子束蒸发将其纯净的形式沉积在未加热的N型化学清洁的基板上,金属形成优异的整流触点,与低于1.1的理想因子,漏电流低至2×10〜(-8)A / cm在-10 V.钛,Pt和Hf在700-750°C的退火后保持整流;在加热至1000°C后,CO变得欧姆。在退火期间的每个金属/ SIC界面处发生大量的扩散和相位演化。

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