LASER MICROMACHINING OF SILICON SUBSTRATES: INVESTIGATION AND UTILISATION OF ASSIST MEDIA

机译：硅基板激光微机械线：辅助媒体的调查和利用

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The use of short and ultrashort pulse lasers for laser micromachining of silicon is now a well advanced manufacturing technique. Applications include semiconductor wafer dicing, inkjet printhead slotting, and substrate structuring for solar cell production. A key element of the laser machining process is the role of the ambient or assist media in relation to enhancing the ablation rate, minimising the negative impact of debris generation, and functionalising the laser generated particulate. This paper will present results of research work focused on the impact of assist media, in particular the use of water, non-polar liquids, and halocarbon gases, in laser micromachining of silicon. Novel observations related to the laser induced liquefaction of assist gases will also be presented.

机译：使用短和超短脉冲激光器进行激光微机械线，现在是一种良好的先进制造技术。应用包括半导体晶片切割，喷墨打印头调节和太阳能电池生产的基板结构。激光加工过程的关键要素是环境或辅助介质的作用，以提高消融率，最小化碎屑产生的负面影响，并对激光产生的颗粒进行功能化。本文将呈现研究工作的结果，其专注于辅助介质，特别是使用水，非极性液体和卤代烃气体的影响，硅的激光微机械。还将提出与激光诱导的辅助气体液化有关的新颖观察。

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《International Congress on Applications of Lasers and Electro-Optics》|2010年||共8页
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Alan Conneely; Sedao; Natalie Haustrup; Gerard M. OConnor;
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1. A Comparison of Dry and Underwater Laser Micromachining of Silicon Substrates [J] . Viboon Tangwarodomnukun, Jun Wang, Philip Mathew Key Engineering Materials . 2010,第期

机译：硅基板干式和水下激光微加工的比较
2. Study on the mechanism of ultrasonic-assisted water confined laser micromachining of silicon [J] . Zhou Jia, Xu Rongwei, Jiao Hui, Optics and Lasers in Engineering . 2020,第Sepa期

机译：超声波辅助水闸机理研究硅的局限性激光微机理
3. Ultrasonic-assisted underwater laser micromachining of silicon [J] . Charee W., Tangwarodomnukun V., Dumkum C. Journal of Materials Processing Technology . 2016,第Null期

机译：超声辅助水下激光微加工硅
4. LASER MICROMACHINING OF SILICON SUBSTRATES: INVESTIGATION AND UTILISATION OF ASSIST MEDIA [C] . Alan Conneely, Sedao, Natalie Haustrup, International Congress on Applications of Lasers and Electro-Optics . 2010

机译：硅基板激光微机械线：辅助媒体的调查和利用
5. Laser-assisted micromachining for subsurface silicon-embedded structures. [D] . Vakanas, George Petrou. 2002

机译：激光辅助微加工，用于埋入地下的硅结构。
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机译：更正：C.-E. Athanasiou。等。使用飞秒激光制造和操作的用于研究二氧化硅多晶型微力学的整体式微拉伸测试仪。微型机械201561365–1386
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机译：在掺杂硅衬底上生长的纳米晶金刚石膜的CO2激光微加工
8. Ion-assisted laser deposition of intermediate layers for YBa2Cu3O(7-delta) thin film growth on polycrystalline and amorphous substrates [R] . Reade, R. P. 1993

机译：离子辅助激光沉积中间层，用于在多晶和非晶基板上生长YBa2Cu3O（7-δ）薄膜

LASER MICROMACHINING OF SILICON SUBSTRATES: INVESTIGATION AND UTILISATION OF ASSIST MEDIA

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