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An alternative format for plastic packaging — Wafer/panel level encapsulation: Its challenges and solutions

机译：塑料包装的另一种形式 - 晶圆/面板级封装：其挑战和解决方案

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This work will discourse on the challenges and solutions that a packaging and/or equipment engineer will face during the molding process of 5S (five-sided) and/or 6S (six-sided) packages at a wafer and/or panel level. This form of packaging is known as large format packaging (LFP). Technical solutions and in particular encapsulation assembly are discussed from the viewpoint of drivers of LFP, CLAP design, encapsulation equipment/tool design, encapsulant and moldability. Based on this work, LFP as a packaging solution is a viable option provided that package co-planarity, optimal encapsulant design, and optimized molding process are enforced. The keys are optimization of equipment, tool and molding process control.
机译：这项工作将讨论包装和/或设备工程师在晶片和/或面板水平的5S（五边）和/或6S（六面）包装的成型过程中面临的挑战和解决方案。这种形式的包装被称为大格式包装（LFP）。从LFP的驱动程序，拍摄设计，封装设备/工具设计，密封剂和可模塑性的驱动器的观点来看，讨论了技术解决方案和特别的封装组件。基于这项工作，LFP作为包装解决方案是一种可行的选择，提供了加强了包装共平面，最佳的密封剂设计和优化的模制过程。键是设备，工具和模制过程控制的优化。

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