Wafer-scale oxide fusion bonding and wafer thinning development for 3D systems integration: Oxide fusion wafer bonding and wafer thinning development for TSV-last integration

机译：3D系统集成晶圆型氧化物融合粘接和晶圆减薄开发：氧化物融合晶圆键合和TSV - 最后一体集成的晶圆减薄开发

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300mm Si wafer-scale oxide fusion bonding and mechanical/wet etch assisted wafer thinning processes were combined with a TSV-last 3D integration strategy to fabricate electrical open/short yield learning on through-wafer electrical TSV test chains.

机译：300mm Si晶片型氧化物熔接和机械/湿蚀刻辅助晶片稀释工艺与TSV-Last 3D集成策略合并，以制造通过晶圆电TSV检测链的电开/短收益率。

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《IEEE International Workshop on Low Temperature Bonding for 3D Integration》|2012年||共6页
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Skordas S.; Tulipe D. C. La; Winstel K.; Vo T. A.; Priyadarshini D.; Upham A.; Song D.; Hubbard A.; Johnson R.; Cauffman K.; Kanakasabapathy S.; Lin W.; Knupp S.; Malley M.; Farooq M. G.; Hannon R.; Berger D.; Iyer S. S.;
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1. Wafer-scale 3D integration of InGaAs photodiode arrays with Si readout circuits by oxide bonding and through-oxide vias [J] . C.L. Chen, D.-R. Yost, J.M. Knecht, Microelectronic Engineering . 2011,第1期

机译：InGaAs光电二极管阵列与硅读出电路的晶圆级3D集成，通过氧化物键合和氧化物通孔实现
2. Aligned Fusion Wafer Bonding for CMOS-MEMS and 3D Wafer-Level Integration Applications [J] . V. DRAGOI, G. MITTENDORFER, C. FLOETGEN, Romanian journal of information science and technology . 2011,第4期

机译：适用于CMOS-MEMS和3D晶圆级集成应用的对准式融合晶圆键合
3. Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration [J] . Ji-Chel Bea, Mariappan Murugesan, Hideto Hashiguchi, Micromachines . 2016,第10期

机译：带有毛细管自组装的氧化物-氧化物热压直接键合技术，用于多芯片至晶圆异质3D系统集成
4. Wafer-scale oxide fusion bonding and wafer thinning development for 3D systems integration: Oxide fusion wafer bonding and wafer thinning development for TSV-last integration [C] . Skordas S., Tulipe D. C. La, Winstel K., Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on . 2012

机译：用于3D系统集成的晶圆级氧化物熔合和晶圆减薄开发：用于TSV-last集成的氧化物熔合晶圆键合和晶圆减薄开发
5. Integration of gallium nitride thin films with dissimilar substrate materials by wafer bonding and laser lift-off. [D] . Wong, William Sam. 1999

机译：通过晶圆键合和激光剥离将氮化镓薄膜与不同的衬底材料集成在一起。
6. Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration [O] . Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, 2016

机译：带有毛细管自组装的氧化物-氧化物热压直接键合技术用于多芯片至晶圆异质3D系统集成
7. Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration [O] . Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, 2016

机译：具有毛细管自组装的氧化物氧化物热压直接键合技术，用于多芯片到晶片的异构3D系统集成

Wafer-scale oxide fusion bonding and wafer thinning development for 3D systems integration: Oxide fusion wafer bonding and wafer thinning development for TSV-last integration

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