Laser Cold Ablation as a Cutting Edge Method of Forming Silicon Wafers Used in Solar Cells

机译：激光冷冻消融作为在太阳能电池中使用的硅晶片的切削刃方法

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The article shows experimental results of mild cutting of surface layers of poly crystalline silicon photovoltaic cells with a picoseconds UV laser. Current technology makes a strong point on reliability and quality of photovoltaic microprocessing. Using short impulse lasers guarantee best quality of cutting edge without burr, HAZ and changing crystalline structure of the base material, with is very important due to electrical conductivity of the solar cell.

机译：本文显示了具有PICOSECONDS UV激光的多晶硅光伏电池的表面层轻微切割的实验结果。目前的技术对光伏微处理的可靠性和质量进行了强大的观点。使用短脉冲激光器保证最佳质量的切削刃，无毛刺，HAZ和晶体结构的基材的晶体结构，由于太阳能电池的电导率是非常重要的。

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《International Conference on Terotechnology》|2014年||共6页
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SlqK Piotr; TOFIL Szymon;
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中图分类 TB3-532;
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laser cold ablation; silicon wafers; solar cells.;

机译：激光冷冻烧蚀;硅晶片;太阳能电池。;

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专利

1. Analysis of nanosecond and femtosecond laser ablation of rear dielectrics of silicon wafer solar cells [J] . Ali Jaffar Moideen Yacob, Shanmugam Vinodh, Khanna Ankit, Solar Energy Materials and Solar Cells: An International Journal Devoted to Photovoltaic, Photothermal, and Photochemical Solar Energy Conversion . 2019,第期

机译：硅晶片太阳能电池后电介质的纳秒和飞秒激光烧蚀分析
2. Femtosecond laser ablation of dielectric layers for high-efficiency silicon wafer solar cells [J] . Ali Jaffar Moideen Yacob, Shanmugam Vinodh, Lim Bianca, Solar Energy . 2018,第APRa期

机译：飞秒激光烧蚀高效率硅晶片太阳能电池的介电层
3. Investigation of laser ablation on boron emitters for n-type rear-junction PERT type silicon wafer solar cells [J] . Chen Jia, Deckers Jan, Choulat Patrick, Progress in photovoltaics . 2015,第12期

机译：n型后结PERT型硅晶片太阳能电池的硼发射体激光烧蚀研究
4. Laser Cold Ablation as a Cutting Edge Method of Forming Silicon Wafers Used in Solar Cells [C] . SlqK Piotr, TOFIL Szymon International Conference on Terotechnology . 2014

机译：激光冷冻消融作为在太阳能电池中使用的硅晶片的切削刃方法
5. Pulsed laser ablation and micromachining of 4H and 6H silicon carbide wafers for high-temperature MEMS sensors. [D] . Gupta, Saurabh. 2008

机译：用于高温MEMS传感器的4H和6H碳化硅晶片的脉冲激光烧蚀和微加工。
6. Improvement of polycrystalline silicon wafer solar cell efficiency by forming nanoscale pyramids on wafer surface using a self-mask etching technique [O] . Hsin-Han Lin, Wen-Hwa Chen, Franklin C.-N. Hong -1

机译：通过使用自掩膜蚀刻技术在晶圆表面形成纳米级金字塔提高多晶硅晶圆太阳能电池效率
7. Rear-Side Contact Opening by Laser Ablation for Industrial Screen-Printed Aluminium Local Back Surface Field Silicon Wafer Solar Cells [O] . Du Zheren, Palina Natalia, Chen Jia, 2012

机译：用于工业丝网印刷铝局部背面场硅晶片太阳能电池的激光烧蚀后侧接触开口

Laser Cold Ablation as a Cutting Edge Method of Forming Silicon Wafers Used in Solar Cells

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