Compact triangulation sensor realized by bending wafer with metal hinge

机译：通过金属铰链弯曲晶圆实现紧凑的三角测量传感器

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A triangulation distance sensor is constructed bending the wafer with metal hinges. On the Si wafer, elements are pre-aligned at the planer condition using the photolithography. The position sensitive detector (PSD), mirror, and alignment pit for a ball lens are prepared. 3-sensor array is integrated in 20 x 17 x 10 mm~3 size. Compared with our previous study using polymer, the metal hinge stabilizes the long-term performance and the process. Optical elements including LD chip are all included on the wafer. The demonstrated measurement range is 18-40 mm.

机译：三角测量距离传感器构造成用金属铰链弯曲晶片。在硅晶片上，使用光刻在平面条件下将元件预对准。准备用于球镜的位置敏感检测器（PSD），反射镜和对准凹坑。 3传感器阵列集成在20 x 17 x 10 mm〜3的尺寸中。与我们先前使用聚合物的研究相比，金属铰链可稳定长期性能和工艺。包括LD芯片在内的光学元件都包含在晶片上。演示的测量范围是18-40 mm。

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来源
《MEMS, MOEMS, and Micromachining II》|2006年|P.618606.1-618606.8|共8页
会议地点 Strasbourg(FR)
作者
Minoru Sasaki; Satoshi Endou; Masayuki Fujishima; Kazuhiro Hane;
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作者单位

Dept.of Nanomechanics Eng., Tohoku University, Aramaki 6-01 Aoba-ku, Sendai, 980-8579, Japan;

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会议组织
原文格式 PDF
正文语种 eng
中图分类真空电子技术;
关键词
triangulation distance sensor; wafer-bending; prealignment; three-dimensional structure;

机译：三角测量距离传感器；晶片弯曲；预对准；三维结构;

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专利

1. Compact Triangulation Sensor Realized by Bending Si Wafer with Optical Elements at Metal Hinges [J] . Minoru Sasaki, Satoshi Endou, Kazuhiro Hane 電気学会論文誌. E, センサ·マイクロマシン準部門誌 . 2008,第6期

机译：通过在金属铰链处弯曲带有光学元件的硅晶圆实现的紧凑型三角测量传感器
2. Compact Triangulation Sensor Array Constructed by Wafer Bending [J] . Satoshi ENDOU, Masahiro ISHIMORI, Minoru SASAKI, Japanese Journal of Applied Physics. Part 1, Regular Papers & Short Notes . 2005,第4B期

机译：晶圆弯曲构造紧凑的三角测量传感器阵列
3. Tunable Vertical Comb for Driving Micromirror Realized by Bending Device Wafer [J] . Minoru SASAKI, Masahiro ISHIMORI, JongHyeong SONG, IEICE Transactions on Electronics . 2007,第1期

机译：弯曲器件晶圆实现微镜可调垂直梳
4. Compact triangulation sensor realized by bending wafer with metal hinge [C] . Minoru Sasaki, Satoshi Endou, Masayuki Fujishima, Conference on MEMS, MOEMS and Micromachining . 2006

机译：紧凑的三角测量传感器通过用金属铰链弯曲晶圆来实现
5. Piezoresistive pressure sensor with integrated amplifier realized using metal-induced laterally crystallized polycrystalline silicon. [D] . Li, Gang. 2005

机译：具有集成放大器的压阻式压力传感器，使用金属感应的横向结晶多晶硅实现。
6. Inspection and Reconstruction of Metal-Roof Deformation under Wind Pressure Based on Bend Sensors [O] . Liman Yang, Langfu Cui, Yunhua Li, 2017

机译：基于弯曲传感器的风压金属屋盖变形检测与修复
7. A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding [O] . Yung Chi-Fan 1973- 1999

机译：一种利用深反应离子刻蚀（DRIE）和对准晶圆键合实现集成惯性传感器的工艺技术

Compact triangulation sensor realized by bending wafer with metal hinge

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