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Design and simulation of a differential and decoupled micromachined gyroscope

机译:差分解耦微机械陀螺仪的设计与仿真

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摘要

In this paper, a differential and decoupled micromachined gyroscope fabricated by through-etching the silicon substrate anodically bonded on the glass substrate was presented. The decoupled structure can make the sense mode frequency match with the drive mode frequency and reduce the quadrature error. The sensitivity is further improved by differential detection using antiphase oscillation of double masses along the drive axis. Finite-element simulation is performed with ANSYS software to analyze the vibration mode. The device employs silicon-on-glass gyroscope sensor chip processed with Deep Reactive Ion Etching (DRIE) and glass-silicon anodic bonding. Then it is tested at atmospheric pressure. Drive mode and sense mode are obtained as 2015 Hz and 1957 Hz which are closed to the simulated ones. Q factor of the drive and sense mode also can be gained as 56 and 3.4.
机译:本文提出了一种微分和解耦的微机械陀螺仪,该陀螺仪是通过对在玻璃基板上阳极键合的硅基板进行完全蚀刻而制成的。去耦结构可以使感测模式频率与驱动模式频率匹配,并减小正交误差。通过使用双重质量沿驱动轴的反相振荡进行差分检测,可以进一步提高灵敏度。用ANSYS软件进行有限元模拟,以分析振动模式。该器件采用经过深度反应离子刻蚀(DRIE)和玻璃-硅阳极键合处理的玻璃-硅陀螺仪传感器芯片。然后在大气压下进行测试。驱动模式和感测模式分别为2015 Hz和1957 Hz,与模拟频率接近。驱动和感测模式的Q因子也可以分别为56和3.4。

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