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首页> 外文会议>Metrology, Inspection, and Process Control for Microlithography XX pt.1 >Multi-layer Overlay Metrology
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Multi-layer Overlay Metrology

机译：多层叠加计量

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摘要

A novel approach to overlay metrology, called Blossom, maximizes the number of layers measurable within a single optical field of view (FOV). As chip processing proceeds, each layer contributes a set of at least four marks, arranged symmetrically on concentric circles, to create a 90° rotationally invariant array of marks that "blossoms" to fill the FOV. Radial symmetry about the target center is maintained at each layer to minimize susceptibility to metrology lens aberrations. Overlay combinations among detectable marks within the target can be measured simultaneously. In the described embodiment, 28 distinct layers are represented within a 50μm square FOV. Thus, all the layers of a functional chip can be represented in a single target. Blossom achieves several benefits relative to overlay methods currently in practice: 1. Compression ( > 30X) of area required for overlay targets. 2. Nullification of within-target proximity effects. 3. Suppression of optical mark fidelity (OMF) errors. 4. Reduction of sensitivity to across-target detection noise. 5. Elimination of overlay error random walk among layers. 6. Reference mark redundancy for detection flexibility and robustness. 7. Integration of multi-layer and within-layer overlay control schema. 8. Simplification of overlay recipe creation and management. 9. Capture and visualization of overlay performance through the entire chip fabrication. Blossom results from 65nm products in manufacturing are described.
机译：一种称为“开花”的新颖的叠加计量方法，可以在单个光学视场（FOV）内最大化可测量的层数。随着切屑处理的进行，每一层贡献一组至少四个在同心圆上对称排列的标记，以创建90°旋转不变的标记阵列，“开花”以填充FOV。在每一层都保持围绕目标中心的径向对称，以最大程度地降低对度量透镜像差的敏感性。可以同时测量目标内可检测标记之间的叠加组合。在所描述的实施例中，在50μm见方的FOV内表示28个不同的层。因此，功能芯片的所有层都可以在一个目标中表示。与当前实践中的叠加方法相比，Blossom具有多个优点：1.压缩叠加目标所需的面积（> 30倍）。 2.消除目标内邻近效应。 3.抑制光学标记保真度（OMF）错误。 4.降低对跨目标检测噪声的敏感性。 5.消除了层间重叠误差随机游动。 6.参考标记冗余，具有检测灵活性和鲁棒性。 7.多层和层内覆盖控制方案的集成。 8.简化叠加配方的创建和管理。 9.捕获和可视化整个芯片制造过程中的覆盖性能。描述了制造中65nm产品的开花结果。

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