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Real-time thermal model of chemical mechanical polishing

机译:化学机械抛光的实时热模型

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摘要

A control-oriented thermal management model of chemical mechanical polishing (CMP) has been developed in this paper. It aims to generate system dynamics with real-time performance for the controller design. A lumped-parameter and low-ordered dynamic model are employed to integrate physical and chemical domains, which including wafer heat transfer, slurry dynamics, and chemistry effects, in the CMP process. Firstly, mechanical and chemical parts are evaluated and constructed together to interpret the transport and reaction system dynamics. Then, modeling and performance analyses are carried out for governing system to operate at optimal temperatures. Due to the dissipating heat generated during the grounding and material-removing processes, it is needed to install a cooling system, which consists of cooling fan, slurry pump, and flow regulating valve. The cooling fan functions depending on the input of slurry temperature, while the flow rate of slurry is controlled by the centrifugal pump. The adjustable valve is used for properly managing the dissipation energy generated by system module. Thereafter, an eighth-order dynamic system can be derived via the technique of lumped parameters. In addition, a rule-based control is implemented afterwards. Consequently, this real-time thermal model is characterized by compact system design, and featured with high flexibility and overall efficiency.
机译:本文开发了一种面向控制的化学机械抛光(CMP)热管理模型。它旨在为控制器设计生成具有实时性能的系统动态。集总参数和低阶动态模型用于在CMP过程中集成物理和化学域,包括晶片传热,浆料动力学和化学效应。首先,对机械和化学零件进行评估和构造,以解释运输和反应系统动力学。然后,进行建模和性能分析,以使控制系统在最佳温度下运行。由于在接地和材料清除过程中会散发热量,因此需要安装冷却系统,该系统由冷却风扇,渣浆泵和流量调节阀组成。冷却风扇的功能取决于浆料温度的输入,而浆料的流量由离心泵控制。可调阀用于正确管理系统模块产生的耗散能量。此后,可以通过集中参数技术导出八阶动态系统。此外,之后将执行基于规则的控制。因此,这种实时热模型具有紧凑的系统设计,并具有很高的灵活性和整体效率。

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