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Laser voltage probe (LVP): a novel optical probing technology forflip-chip packaged microprocessors

机译：激光电压探针（LVP）：用于 n倒装芯片封装微处理器的新型光学探测技术

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A novel optical probing technique to measure voltage waveformsnfrom flip-chip packaged CMOS integrated circuits (IC) is described. ThisnIR laser based technique allows signal waveform acquisition and highnfrequency timing measurements directly from active P-N junctions throughnthe silicon backside substrate on ICs mounted in flip-chip stand-alonenor multi-chip module packages as well as wire-bond packages on which thenchip backside is accessible. The technique significantly improvesnsilicon debug and failure analysis (FA) throughput time (TPT) asncompared to backside electron-beam (e-beam) probing because of thenelimination of backside trenching and probe hole generation operations

机译：描述了一种新颖的光学探测技术，用于测量倒装芯片封装的CMOS集成电路（IC）的电压波形。这项基于nIR激光器的技术允许直接通过有源P-N结通过安装在倒装芯片独立或多芯片模块封装中的IC的硅背面衬底以及可访问芯片背面的引线键合封装来进行信号波形采集和高频定时测量。与背面电子束（e-beam）探测相比，该技术显着提高了硅调试和故障分析（FA）吞吐时间（TPT），这是由于消除了背面沟槽和探针孔生成操作

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来源
《Requirements Engineering (RE 2007)》|2007年|p.15-20|共6页
会议地点
作者
Wai Mun Yee; Paniccia M.; Eiles T.; Rao V.;
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作者单位

Intel Technol., Penang;

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原文格式 PDF
正文语种 eng
中图分类自动化技术、计算机技术;
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专利

1. Laser Voltage Probing (LVP) - Its value and the race against scaling [J] . Ganesh Ulrike Microelectronics & Reliability . 2016,第SEPa期

机译：激光电压探测（LVP）-它的价值和对抗标度的竞争
2. Novel Optical Probing and Micromachining Techniques for Silicon Debug of Flip Chip Packaged Microprocessors [J] . Mario Paniccia, T. Eiles, R. Livengood Microelectronic Engineering . 1999,第1a4期

机译：用于倒装芯片封装微处理器的硅调试的新型光学探测和微加工技术
3. Liquid immersion lens technology applied to laser voltage probing of 130 nm process technology devices [J] . Nagamani Nataraj, Herve Deslandes, William Lo, Journal of Vacuum Science & Technology. B, Microelectronics Processing and Phenomena . 2002,第6期

机译：液浸透镜技术应用于130 nm工艺技术设备的激光电压探测
4. Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip Packaged Microprocessors [C] . Wai Mun Yee, Mario Paniccia, Travis Eiles, 26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington . 2000

机译：激光电压探针（LVP）：一种用于倒装芯片封装微处理器的新型光学探测技术
5. Terahertz spectroscopy and laser induced infrared emission spectroscopy of nitromethane and optical properties of laser-induced carriers on semiconductor surfaces probed by a 10.6 micron wavelength carbon dioxide laser. [D] . Toyoda, Yoshimasa. 2008

机译：硝基甲烷的太赫兹光谱和激光诱导红外发射光谱，以及用10.6微米波长的二氧化碳激光器探测的半导体表面上激光诱导的载流子的光学特性。
6. Action Potential Dynamics in Fine Axons Probed with an Axonally Targeted Optical Voltage Sensor [O] . Yihe Ma, Peter O. Bayguinov, Meyer B. Jackson 2017

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7. Structure and function of the voltage sensor of sodium channels probed by a beta-scorpion toxin. : Voltage Sensor of Sodium Channels Probed by a β-Scorpion Toxin [O] . Cestèle Sandrine, Yarov-Yarovoy Vladimir, Qu Yusheng, 2006

机译：β蝎毒素探测到的钠通道电压传感器的结构和功能。：用β-蝎毒素探测钠通道的电压传感器
8. Pump-probe method for investigating laser ablation and optical damage threshold mechanisms in optical materials [R] . Chase, L L 1993

机译：用于研究光学材料中激光烧蚀和光损伤阈值机制的泵浦探针法

Laser voltage probe (LVP): a novel optical probing technology forflip-chip packaged microprocessors

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