Product development in the power electronic industry is characterized by short time-to-market and high reliability. Improved design methods and advanced modeling techniques are therefore required to support package design selection and to arrive at lifeime prediction algorithms for failure prevention. In this work experimental and computational activities aimed at supporting the development of a high-power press-pack (GBT are reported. A rig for accelerated testign of single IGBT chips under controlled contact pressure conditiosn is presented. Then, thermo-mechanical simulations of accelerated tests by the finite element method provided stress/strain evolution in the device and insight into the sources of local degradation.
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