In this study multilayered structures of Cu and Ni (20 to 30 nm bilayer thickness) were fabricated by electrodeposition. The anodic passivity of Ni and the irreversibility of the Ni-Ni~(+2) reaction permit alternate deposition of each metal layer from a common electrolyte. A potentiostatic method was used for the deposition. Tensile testing revealed that the structures produced in this study fractured without gross plasticity. In majority of the samples two distinct zones were observed on the fracture surface: oen ductile and the other brittle. This paper discusses the effect of copper concentration on the fracture behavior of Cu/Ni laminated composites.
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