As the rapid growth of hand held electronics, including PDA, GPS and combinations of these products is keeping on pushing surface mounting density to become more and more compact. In order to produce these multi-functional next generation devices, miniature components such as LCD Drivers, RF Modules and SA W Filters are required. The discrete components also shrink in size rapidly. As a result, the 0201 chip component is being utilized in the design phase of these devices to increase miniaturization and add more product functionality. In both of our current prototype build and mass production, more and more PCBA with 0201 chips has been used in various electronic products. A successful assembly of such small size components needs special care for assembly processes. The PCB design, soldering material, printing process, placement accuracy, as well as reflow process could all impact final assembly quality. In order to better prepared for the manufacturing, it is extremely important to develop a robust 0201 chip assembly process. We have started 0201 assembly qualification project to fulfill the current and near future needs. A systematic study was conducted to determine the best process parameters for assembling 0201 chips on a PCB using high-speed chip shooter. A statistical design of experiments (DOE) was used to aid us understanding the correlation between various process parameters. It had helped us to determine the optimal screen-printing conditions, stencil design, critical process and PCB design parameters for 0201 chip assembly in current mass production. Solectron Suzhou started the 0201 chip components assembly on mobile phone in mass production since 2001. This paper will demonstrate the production challenges and typical defect types, defect rates, as well as solutions.
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