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Synthesis of Ⅲ-N_x-V_(l-x) Thin Films by N Ion Implantation

机译:N离子注入法合成Ⅲ-N_x-V_(l-x)薄膜

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摘要

Dilute III-N_x-V_(l-x) alloys were successfully synthesized by nitrogen implantation in GaAs and InP. The fundamental band gap energy for the ion beam synthesized III-N_x-V_(l-x) alloys was found to decrease with increasing N implantation dose in a manner similar to that commonly observed in epitaxially grown GaN_xAs_(l-x) and InN_xP_(l-x) thin films. The fraction of N occupying anion sites ("active" N) in the GaN_xAs_(l-x) layers formed by N implantation was thermally unstable and decreased with increasing annealing temperature. In contrast, thermally stable InN_xP_(l-x) alloys with N mole fraction as high as 0.012 were synthesized by N implantation in InP. Moreover, the N activation efficiency in InP was at least a factor of two higher than in GaAs under similar processing conditions. The low N activation efficiency (<20%) in GaAs can be improved by co-implanting Ga and N in GaAs.
机译:通过在GaAs和InP中氮注入成功地合成了稀III-N_x-V_(l-x)合金。发现离子束合成的III-N_x-V_(lx)合金的基本带隙能随着氮注入剂量的增加而降低,其方式与在外延生长的GaN_xAs_(lx)和InN_xP_(lx)薄膜中通常观察到的方式相似。 。通过N注入形成的GaN_xAs_(1-x)层中的N占据阴离子位点的部分(“活性” N)是热不稳定的,并且随着退火温度的升高而降低。相反,通过在InP中进行N注入,合成了N摩尔分数高达0.012的热稳定的InN_xP_(1-x)合金。而且,在相似的处理条件下,InP中的N活化效率比GaAs中的N活化效率至少高两倍。通过将Ga和N共注入GaAs中,可以改善GaAs中的低N活化效率(<20%)。

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