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首页> 外文学位 >Development of a new generation polyurethane polishing pad used in chemical mechanical planarization of microelectronic materials.
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Development of a new generation polyurethane polishing pad used in chemical mechanical planarization of microelectronic materials.

机译：开发用于微电子材料化学机械平面化的新一代聚氨酯抛光垫。

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摘要

This work investigated the development of a new polyurethane polishing pad used in chemical mechanical planarization (CNT) for the manufacture of micro-electronic materials. This next generation of hard and porous pad was successfully developed at Freudenberg Nonwovens. An earlier version (FX-9) of this pad, based on licensed technology, was used as the reference for development of the Pad P.; The polymeric microspheres in the previous (FX-9) formulation were replaced with a non-woven fabric composed of three different fibers. Eliminating the microspheres enabled the forming of the new pad material at a higher temperature with shorter forming time, decreasing the forming time of the pads. Density and hardness of the new pad material was higher than the FX-9 material and the compressibility was lower. Dynamic mechanical analysis showed that the new pad was more rigid and stable at increasing temperatures compared to FX-9. The fiber network in the non-woven fabric took the role of the microspheres, to assist the wafer debris collection in CNT. Planarization rates in CMP were higher for the new pad compared to FX-9.; To correlate the polishing performance to the pad properties, a combination of pads were produced with low and high roughness, hardness and thickness. It was not possible to produce the new pad having a smooth surface finish with lower thickness. Varying the components in the formulation produced softer and flexible pads.
机译：这项工作研究了用于化学机械平面化（CNT）的用于制造微电子材料的新型聚氨酯抛光垫的开发。科德宝非织造布成功开发了这种下一代的硬质多孔垫。该垫的早期版本（FX-9）基于许可技术，被用作Pad P的开发参考。以前（FX-9）配方中的聚合物微球被由三种不同纤维组成的无纺布所代替。消除微球使得能够在较高的温度下以较短的形成时间形成新的衬垫材料，从而减少了衬垫的形成时间。新垫材料的密度和硬度高于FX-9材料，而可压缩性则更低。动态力学分析表明，与FX-9相比，该新型垫片在升高的温度下更具刚性和稳定性。无纺布中的纤维网络起着微球的作用，以帮助将晶片碎屑收集在CNT中。与FX-9相比，新垫的CMP平面化率更高。为了使抛光性能与垫的性能相关，生产了具有低和高粗糙度，硬度和厚度的垫的组合。不可能生产出具有较低厚度的光滑表面光洁度的新垫。改变配方中的成分可生产出更柔软的衬垫。

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  • 作者

    Shah, Viraj K.;

  • 作者单位

    University of Massachusetts Lowell.;

  • 授予单位 University of Massachusetts Lowell.;
  • 学科 Plastics Technology.; Chemistry Polymer.
  • 学位 M.S.
  • 年度 2002
  • 页码 p.551
  • 总页数 88
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 整形外科学（修复外科学）;
  • 关键词

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