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首页> 外文期刊>Applied Surface Science >Chemical structures and electrical properties of atomic layer deposited HfO_2 thin films grown at an extremely low temperature (≤100 ℃) using O_3 as an oxygen source
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Chemical structures and electrical properties of atomic layer deposited HfO_2 thin films grown at an extremely low temperature (≤100 ℃) using O_3 as an oxygen source

机译:O_3作为氧源在极低温(≤100℃)下生长的原子层沉积HfO_2薄膜的化学结构和电学性质

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摘要

The properties of atomic layer deposited (ALD) HfO_2 films grown at low temperatures (≤100℃) were examined for potential applications in flexible display and bioelectronics. A saturated ALD growth behavior was observed even at an extremely low temperature (30 ℃) due to the strong oxidizing potential of O_3. However, HfO_2 films grown at low temperatures showed a low film density and high impurity concentration, because the thermal energy during film growth was insufficient to remove ligands completely from Hf ions in precursor molecule. This resulted in low dielectric constant and high leakage current density of the films. Nevertheless, HfO_2 film grown at 100 ℃ using O_3 gas with a high concentration (390g/Nm~3) showed a tolerable impurity concentration with the dielectric constant of ~16 and breakdown field of ~4MV/cm, which are approximately two-thirds of those of HfO_2 film grown at 250℃.
机译:考察了在低温(≤100℃)下生长的原子层沉积(ALD)HfO_2薄膜的性能在柔性显示器和生物电子学中的潜在应用。由于O_3的强氧化电位,即使在极低的温度(30℃)下也观察到了饱和的ALD生长行为。然而,在低温下生长的HfO_2膜显示出低的膜密度和高的杂质浓度,因为在膜生长期间的热能不足以完全从前体分子中的Hf离子中去除配体。这导致薄膜的低介电常数和高泄漏电流密度。然而,使用高浓度(390g / Nm〜3)的O_3气体在100℃下生长的HfO_2膜显示出可容忍的杂质浓度,介电常数为〜16,击穿场为〜4MV / cm,大约为三分之二。 HfO_2薄膜在250℃下生长。

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  • 来源
    《Applied Surface Science》 |2014年第15期|852-856|共5页
  • 作者单位

    WCU Hybrid Materials Program, Department of Materials Science & Engineering and Inter-university Semiconductor Research Center, Seoul National University, Seoul 157-742, Korea,Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials, Daejeon 305-343, Korea;

    Department of Materials Science & Engineering, Hanyang University, Ansan 426-791, Korea;

    Electronic Materials Research Center, Korea Institute of Science and Technology, Seoul 136-791, Korea;

    Center for Correlated Electron Systems, Institute for Basic Science, and Department of Physics and Astronomy, Seoul National University, Seoul 151-747, Korea;

    WCU Hybrid Materials Program, Department of Materials Science & Engineering and Inter-university Semiconductor Research Center, Seoul National University, Seoul 157-742, Korea;

    WCU Hybrid Materials Program, Department of Materials Science & Engineering and Inter-university Semiconductor Research Center, Seoul National University, Seoul 157-742, Korea;

    WCU Hybrid Materials Program, Department of Materials Science & Engineering and Inter-university Semiconductor Research Center, Seoul National University, Seoul 157-742, Korea;

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  • 正文语种 eng
  • 中图分类
  • 关键词

    Atomic layer deposition; HfO_2; Ozone concentration; Low temperature process;

    机译:原子层沉积;HfO_2;臭氧浓度低温工艺;

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