• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Applied Surface Science >Laser-induced etching of tungsten and fused silica in WF_6
【24h】

Laser-induced etching of tungsten and fused silica in WF_6

机译：WF_6中激光诱导的钨和熔融石英刻蚀

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Etching of tungsten and fused silica induced by a focused argon-ion laser beam at λ = 514 nm has been investigated on a composite consisting of a thin W-layer sputtered onto a fused silica substrate. Pure WF6 gas serves as the reactant for both W-and silica-etching. The process starts with pure chemical etching of tungsten. As the thin W-layer is etched through, it continues as a combination of etching of both tungsten and silica. The latter is most probably caused by the formation of fluorine radicals at high temperatures. The analysis of the process is supported by theoretical estimations of temperatures and of the profile evolution of the etched holes.
机译：在由溅射在熔融石英基板上的薄W层组成的复合材料上，研究了在λ= 514 nm处聚焦的氩离子激光束引起的钨和熔融石英的刻蚀。纯WF6气体充当W和二氧化硅蚀刻的反应物。该过程从钨的纯化学蚀刻开始。随着薄W层的蚀刻，它继续作为钨和二氧化硅蚀刻的组合。后者很可能是由于高温下形成氟自由基所致。对过程的分析得到温度和蚀刻孔轮廓演变的理论估计的支持。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号