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首页> 外文期刊>IEEE Transactions on Components and Packaging Technologies >An investigation into the effects of flux residues on properties of underfill materials for flip chip packages
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An investigation into the effects of flux residues on properties of underfill materials for flip chip packages

机译：助焊剂残留物对倒装芯片封装底部填充材料性能的影响研究

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摘要

Flux is necessary to promote wetting between solder and metallized surfaces during flip chip bonding process. However, flux residues are unavoidable and may have detrimental effects on the properties of the underfill materials. In this study, the effects of flux residues from a commercial no-clean flux on two types of underfills were systematically investigated using a contact angle goniometer, thermal mechanical analyzer (TMA), thermogravimetric analyzer (TGA) and dynamic mechanical analyzer (DMA). It was found that the presence of flux residue reduced the glass transition temperatures (Tg) of both cured underfills studied. Although /spl alpha//sub 1/ (CTE below Tg) of cured underfills were slightly affected, /spl alpha//sub 2/ (CTE above Tg) increased significantly. The DMA tan/spl delta/ curves of flux residue contaminated samples were found to be broader than those of pure underfills. In addition, the rubbery storage moduli of underfills contaminated with flux residues also decreased significantly. The existence of flux residues was found to increase the moisture absorption of the cured underfills.
机译：在倒装芯片焊接过程中，助焊剂对于促进焊料和金属化表面之间的润湿是必不可少的。但是，助焊剂残留是不可避免的，并且可能会对底部填充材料的性能产生不利影响。在这项研究中，使用接触角测角仪，热机械分析仪（TMA），热重分析仪（TGA）和动态机械分析仪（DMA）系统地研究了商业免清洗助焊剂残留的助焊剂对两种类型的底部填充胶的影响。发现助焊剂残留物的存在降低了所研究的两种固化底部填料的玻璃化转变温度（Tg）。尽管固化的底部填充胶的/ spl alpha // sub 1 /（CTE低于Tg）受到轻微影响，但/ spl alpha // sub 2 /（CTE高于Tg）明显增加。发现被助焊剂残留物污染的样品的DMA tan / spl delta /曲线比纯底部填充胶的宽。此外，被助焊剂残留物污染的底部填充胶的储能模量也显着降低。发现助焊剂残留物的存在会增加固化的底部填充材料的吸湿性。

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