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首页> 外文期刊>IEEE Transactions on Components and Packaging Technologies >Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling
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Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling

机译：通过考虑湿气引起的模制化合物溶胀来评估IC封装接口分层

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We have determined the influence of moisture soaking conditions on true adhesion strength measured by our previously developed method. The drop in true adhesion strength of a specimen that absorbed moisture at 50/spl deg/C is about 50% less than that of a specimen at 85/spl deg/C. This result suggests that the true adhesion strength depends on not only the moisture content but also the moisture absorption temperature. Therefore, we think that the general moisture condition (85/spl deg/C/85%) causes more damage to plastic integrated circuit (IC) packages than that of moisture absorption at room temperature. We also evaluated interface delamination in a moisture-absorbed package by considering the swelling of the molding compound due to moisture absorption. The predicted interface delamination agrees well with the experimental data for moisture-soaked packages.
机译：我们已经确定了吸湿条件对通过我们以前开发的方法测得的真实粘合强度的影响。在50 / spl℃/℃下吸收水分的样品的真实粘合强度下降比在85 / spl℃/℃下吸收样品的真实粘合强度下降约50％。该结果表明，真正的粘合强度不仅取决于水分含量，还取决于水分吸收温度。因此，我们认为一般的湿度条件（85 / spl deg / C / 85％）对塑料集成电路（IC）封装的损坏要比在室温下吸收水分的损坏大。我们还考虑了由于吸湿而引起的模塑料膨胀，从而评估了吸湿包装中的界面分层。预测的界面分层与湿透包装的实验数据非常吻合。

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