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Finite-element electromagnetic characterization of parasitics in multifinger thermally shunted HBTs

机译:多指热并联HBT中寄生物的有限元电磁表征

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摘要

This work describes a methodology to extract parasitic capacitances and evaluate losses in multifinger thermally shunted heterojunction bipolar transistors (HBTs) using three dimensional (3-D) electromagnetic modeling. This method is based on the partitioning of the structure into zones of propagation, which simplifies the analysis of the computed scattering matrices. The approach is validated using on-wafer measurements of open-circuit test structures. This work also addresses the impact of changes in device topology on parasitic coupling capacitance and association efficiency.
机译:这项工作描述了一种使用三维(3-D)电磁建模提取寄生电容并评估多指热并联异质结双极晶体管(HBT)中的损耗的方法。此方法基于将结构划分为传播区域,从而简化了对计算的散射矩阵的分析。使用开路测试结构的晶圆上测量来验证该方法。这项工作还解决了器件拓扑变化对寄生耦合电容和关联效率的影响。

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