首页> 外文期刊>IEEE Transactions on Semiconductor Manufacturing >Single-wafer polysilicon engineering for the improvement of over erase in a 0.18-/spl mu/m floating-gate flash memory
【24h】

Single-wafer polysilicon engineering for the improvement of over erase in a 0.18-/spl mu/m floating-gate flash memory

机译:单晶片多晶硅工程技术,用于改善0.18- / splμ/ m浮栅闪存中的过擦除

获取原文
获取原文并翻译 | 示例
           

摘要

A new polysilicon grain engineering technology for the improvement of over erase in 0.18-/spl mu/m floating-gate flash memory has been developed with the use of single-wafer polysilicon processing, which makes it practical to use hydrogen as a process variable. The addition of hydrogen in polysilicon deposition significantly alters the reaction kinetics and produces polysilicon thin film of smooth surface, fine and uniformly distributed grains. Such a micrograin polysilicon possesses show excellent high-temperature stability. The benefits of the micrograin polysilicon are to be demonstrated through its improvement in over erase of a 0.18-/spl mu/m floating-gate flash memory.
机译:通过使用单晶片多晶硅工艺,开发了一种新的多晶硅晶粒工程技术,用于改善0.18- / splμm/ m浮栅闪存中的过擦除,这使得使用氢作为工艺变量非常实用。在多晶硅沉积中添加氢会显着改变反应动力学,并产生光滑表面,细小且均匀分布的晶粒的多晶硅薄膜。这样的微晶多晶硅具有优异的高温稳定性。微晶多晶硅的好处将通过其对0.18- / splμ/ m浮栅闪存的过度擦除的改善来证明。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号