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Comparing sintering and atomic layer deposition as methods to mechanically reinforce nanocolloidal crystals

机译:比较烧结和原子层沉积作为机械增强纳米胶体晶体的方法

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摘要

Nanocolloidal crystals (NCCs) have promising applications in optical and photonic devices. However, it is critical to mechanically reinforce NCCs for device reliability, since as-synthesized NCCs are fragile due to weak interparticle bonding. Thermal sintering is currently the most common reinforcement technique; however, this method could induce serious cracking and is not suitable for temperature-sensitive materials. In this study, by characterizing silica NCCs reinforced through sintering and alumina atomic layer deposition (ALD), we find that the ALD treatment is much more effective for hardening, stiffening, and more importantly toughening NCCs. Thermally sintered NCCs are prone to indentation-induced cracking due to large residual tensile stress, significantly impairing the toughness. In contrast, the ALD treatment toughens NCCs by much over 300%. Our finding provides insights for reinforcing and toughening various nanoparticle-based and nanoporous materials.
机译:纳米胶体晶体(NCC)在光学和光子器件中具有广阔的应用前景。但是,机械增强NCC对设备的可靠性至关重要,因为合成后的NCC由于弱的粒子间键合而易碎。热烧结是目前最常用的增强技术。但是,这种方法可能导致严重的开裂,因此不适用于对温度敏感的材料。在这项研究中,通过表征通过烧结和氧化铝原子层沉积(ALD)增强的二氧化硅NCC,我们发现ALD处理对于NCC的硬化,硬化以及更重要的是增韧更为有效。由于大的残余拉伸应力,热烧结的NCC易于产生压痕引起的开裂,从而大大削弱了韧性。相比之下,ALD处理可使NCC增韧300%以上。我们的发现为增强和增韧各种纳米颗粒和纳米多孔材料提供了见识。

著录项

  • 来源
    《Journal of Materials Research》 |2015年第23期|3717-3727|共11页
  • 作者单位

    Department of Mechanical Engineering, Villanova University, Villanova, Pennsylvania 19085, USA;

    Department of Mechanical Engineering, Villanova University, Villanova, Pennsylvania 19085, USA;

    Department of Mechanical Engineering, Villanova University, Villanova, Pennsylvania 19085, USA;

    Department of Chemical and Biomolecular Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, USA,Department of Chemical Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, USA;

    Department of Chemical and Biomolecular Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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