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Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad

机译：锌对铜垫上Sn-3.5Ag焊料的金属间化合物形成和可靠性的影响

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摘要

Varying amounts of Zn (1, 3, and 7 wt%) were added to Sn-3.5Ag solder on a Cu pad, and the resultant solder joint microstructures after a reflow and isothermal aging (150℃, up to 500 h) were investigated using scanning electron microscopy, energy dispersive x-ray, and x-ray diffraction, which were subsequently correlated to the results of microhardness and drop tests. Zinc was effective in improving the drop resistance of Sn-3.5Ag solder on the Cu pad, and an addition of 3 wt% Zn nearly doubled the number of drops-to-failure (N_f). The beneficial role of Zn was ascribed to suppression of Cu_6Sn_5 and precipitation of Zn-containing intermetallic compounds (IMCs). However, the Zn effect was reduced as Cu_6Sn_5 and Ag_3Sn precipitated in a joint IMC layer after prolonged aging. The interface between Ag_5Zn_8 and Cu_5Zn_8 was resistant to drop impact, but two other layered IMC structures of Cu_6Sn_5/Cu_3Sn and Cu_5Zn_8/Cu_6Sn_5 were not.
机译：在Cu焊盘上的Sn-3.5Ag焊料中添加各种含量的Zn（1、3和7 wt％），并研究了回流和等温老化（150℃，长达500 h）后得到的焊点微观结构。使用扫描电子显微镜，能量色散X射线和X射线衍射，它们随后与显微硬度和跌落测试的结果相关。锌有效地改善了Sn-3.5Ag焊料在Cu焊盘上的抗滴落性，并且添加3 wt％的Zn几乎使掉落至失效的数量（N_f）翻了一番。锌的有益作用归因于抑制Cu_6Sn_5和沉淀含锌金属间化合物（IMC）。然而，随着时间的流逝，Cu_6Sn_5和Ag_3Sn在共同的IMC层中析出，从而降低了Zn的影响。 Ag_5Zn_8和Cu_5Zn_8之间的界面抗跌落冲击，但Cu_6Sn_5 / Cu_3Sn和Cu_5Zn_8 / Cu_6Sn_5的另外两个层状IMC结构则不然。

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  • 来源
    《Journal of Materials Research》 |2007年第7期|p.1879-1887|共9页
  • 作者

    Y.K. Jee; Y.H. Ko; Jin Yu;

  • 作者单位

    Department of Material Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Yuseong-gu, Daejeon 305-701, Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
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