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首页> 外文期刊>Science and Technology of Advanced Materials >Joint strength and interfacial microstructure between Sn-Ag-Cu and Sn-Zn-Bi solders and Cu substrate
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Joint strength and interfacial microstructure between Sn-Ag-Cu and Sn-Zn-Bi solders and Cu substrate

机译：Sn-Ag-Cu和Sn-Zn-Bi焊料与Cu基体的结合强度和界面微观结构

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摘要

In the present research, in order to fundamentally investigate the strength and interfacial microstructure of the joints between Sn-3.5Ag-0.7Cu (SAC) and Sn-8Zn-3Bi (SZB) solders and Cu, examinations using the standardized solder joint specimen for measuring the shear strength were performed. The effects of the addition of Ag, Bi and Pb to the solders, which are the ingredients of possible lead plating materials of quad plat package, solder layer thickness and aging treatments ranging from 358 to 423 K were investigated. The SAC base solder joints, whose strength hardly degraded after aging, were more reliable than the SZB base solder joints. Since no detrimental effect of the Bi or Pb addition was recognized, the lead plating materials are found to have no significant effect on the strength of the SAC solder joints. Although the SZB base solder joints had higher strength than the SAC base solder joints in as-soldered condition, a significant degradation of the joint strength occurred after aging. In the case of thinner solder layer of 20 μm, the Cu_6Sn_5 layer that formed at both the solder/Cu_5Zn_8 and Cu_5Zn_8/Cu interfaces after aging caused the fracture of the solder joints and resulted in the degradation of the joint strength. In the case of thicker solder layer of 100 μm, the Cu_5Zn_8 interfacial layer continuously grew during aging, which caused the fracture of the solder joints and resulted in the decrease in the joint strength. As for the effect of the addition elements, while Pb addition caused a marked degradation of the joint strength, Ag addition and Bi addition had no detrimental effect on the strength of the solder joints. In particular, the joint with the Ag addition solder had the better strength in the case of thinner solder layer. Thus, as for lead plating for the SZB solder, Sn-Pb should be avoided and Sn-Bi or Sn-Ag as Pb-free plating has no detrimental effect on the joint strength. In particular, Sn-Ag plating is preferable in the viewpoint of the joint strength.
机译：在本研究中，为了从根本上研究Sn-3.5Ag-0.7Cu（SAC）和Sn-8Zn-3Bi（SZB）焊料与Cu之间的接头强度和界面微观结构，请使用标准的焊点试样进行检查测量抗剪强度。研究了在焊料中添加Ag，Bi和Pb的影响，这些元素是四板封装中可能的铅镀层材料的成分，焊料层的厚度以及358至423 K的时效处理。 SAC基础焊点的强度在老化后几乎不会降低，它比SZB基础焊点更可靠。由于未发现Bi或Pb的添加有有害作用，因此发现铅镀层材料对SAC焊点的强度没有显着影响。尽管在焊接状态下SZB基础焊点的强度比SAC基础焊点的强度高，但老化后，接合强度会明显下降。在20μm的较薄焊料层的情况下，在老化后在焊料/ Cu_5Zn_8和Cu_5Zn_8 / Cu界面处形成的Cu_6Sn_5层导致焊料接合处断裂并且导致接合强度降低。在100μm的较厚焊料层的情况下，Cu_5Zn_8界面层在时效过程中连续生长，这导致焊料接合处断裂并且导致接合强度降低。至于添加元素的作用，尽管添加铅会导致接头强度明显下降，但是添加银和添加铋对焊点的强度没有不利影响。特别地，在较薄的焊料层的情况下，与Ag添加焊料的接合处具有更好的强度。因此，对于用于SZB焊料的铅镀层，应避免使用Sn-Pb，而无铅镀层的Sn-Bi或Sn-Ag对接点强度没有不利影响。从接合强度的观点出发，特别优选Sn-Ag镀敷。

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