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首页> 外文期刊>Thermochimica Acta: An International Journal Concerned with the Broader Aspects of Thermochemistry and Its Applications to Chemical Problems >Thermomechanical and viscoelastic behavior of a no-flow underfill material for flip-chip applications
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Thermomechanical and viscoelastic behavior of a no-flow underfill material for flip-chip applications

机译：倒装芯片应用中不流动底部填充材料的热机械和粘弹性行为

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No-flow underfill is an alternative material technology for packaging high-speed flip-chip assemblies in microelectronics industry. In this study, the thermal expansion behavior of a cured no-flow underfill material was examined by thermomechanical analysis (TMA), and the dynamic mechanical behavior was investigated by dynamic mechanical analysis (DMA) at a fixed frequency of 1 Hz. In addition, because the no-flow underfill material is polymer-based and its mechanical properties are influenced by both temperature and time, it is important to consider its viscoelastic behavior. This was accomplished by conducting the time-temperature superposition (TTS) experiments using DMA. From the TTS results, master curves were constructed for both the storage (E) and the loss moduli (E '') as a function of frequency at a pre-selected reference temperature. The shift factors along the frequency axis were also determined as a function of temperature, and they can be fitted using the Williams-Landel-Ferry (WLF) equation. Based on the master curves for E' and E, one can obtain the relaxation modulus, E(t,T), as a function of time and temperature. The measured thermomechanical and viscoelastic properties of the no-flow underfill material provided crucial material properties for accurately modeling the package stress. (C) 2005 Elsevier B.V. All rights reserved.
机译：无流动底部填充是微电子行业中用于包装高速倒装芯片组件的替代材料技术。在这项研究中，通过热机械分析（TMA）检查了固化的无流动底部填充材料的热膨胀行为，并通过动态机械分析（DMA）在1 Hz的固定频率下研究了动态机械行为。另外，由于不流动的底部填充材料是基于聚合物的，并且其机械性能受温度和时间的影响，因此考虑其粘弹性行为很重要。这是通过使用DMA进行时间-温度叠加（TTS）实验来完成的。根据TTS结果，在预先选择的参考温度下，根据频率构建了主存储曲线（E）和损耗模量（E''）。还确定了沿频率轴的位移因子与温度的关系，可以使用Williams-Landel-Ferry（WLF）方程进行拟合。根据E'和E的主曲线，可以获得随时间和温度变化的松弛模量E（t，T）。测得的非流动性底部填充材料的热机械和粘弹性能为精确模拟封装应力提供了至关重要的材料特性。 （C）2005 Elsevier B.V.保留所有权利。

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